Phonon scattering at the interface between two materials results in a thermal resistance, R [1]. An ability to accurately predict the thermal resistance of semiconductor interfaces is important in devices where phonon interface scattering is a significant contributor to the overall thermal resistance (e.g., computer chips with high component density). This ability will also lead to improvements in the design of semiconductor superlattices with low thermal conductivity, desirable in thermoelectric energy conversion applications [2].

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