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Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T10A014, July 9–12, 2017

Paper No: HT2017-4734

DOI: https://doi.org/10.1115/HT2017-4734

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Topics: Hydrodynamics, Junctions, Microfluidics, Slug flows, Two-phase flow, Flow (Dynamics), Water, Fluids, Geometry, Glass

Proceedings Papers

Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles

Anand K. Patel, Weihuan Zhao

Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T09A003, July 9–12, 2017

Paper No: HT2017-4731

DOI: https://doi.org/10.1115/HT2017-4731

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Topics: Cooling, Electric vehicles, Electronics, Graphite, Heat transfer, Vapors, Heat, Flat heat pipes, Copper, Heat flux

Proceedings Papers

Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris

Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A001, July 10–14, 2016

Paper No: HT2016-7043

DOI: https://doi.org/10.1115/HT2016-7043

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Topics: Metrology, Resolution (Optics), Steady state, Flow (Dynamics), Heat, Interfacial thermal resistance, Junctions, Measurement systems, Measurement uncertainty, Performance characterization

Proceedings Papers

Microscale Phase Separation Through Nanoporous Membranes

Abdy Fazeli, Saeed Moghaddam

Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A009, July 14–19, 2013

Paper No: HT2013-17633

DOI: https://doi.org/10.1115/HT2013-17633

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Topics: Membranes, Microscale devices, Phase separation, Bubbles, Microchannels, Pressure, Two-phase flow, Water, Air flow, Flow (Dynamics)

Proceedings Papers

Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction

Hua Bao, Shirui Luo, Ming Hu

Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A039, July 14–19, 2013

Paper No: HT2013-17176

DOI: https://doi.org/10.1115/HT2013-17176

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Topics: Carbon, Graphene, Junctions, Nanotubes, Carbon nanotubes, Energy dissipation, Heat, Silicon, Thermal conductivity, Engineering systems and industry applications

Proceedings Papers

Heat Dissipation Mechanism at Supported CNT-CNT Junctions

Liang Chen, Satish Kumar

Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 559-566, July 8–12, 2012

Paper No: HT2012-58283

DOI: https://doi.org/10.1115/HT2012-58283

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Topics: Carbon nanotubes, Energy dissipation, Heat, Junctions, Temperature, Density, Electromagnetic spectrum, Energy transformation, Molecular dynamics, Nanotubes

Proceedings Papers

One-Dimensional Simulation of a Stirling Three-Stage Pulse-Tube Refrigerator

M. A. Etaati, R. M. M. Mattheij, A. S. Tijsseling, A. T. A. M. de Waele

Proc. ASME. HT2009, Volume 3: Combustion, Fire and Reacting Flow; Heat Transfer in Multiphase Systems; Heat Transfer in Transport Phenomena in Manufacturing and Materials Processing; Heat and Mass Transfer in Biotechnology; Low Temperature Heat Transfer; Environmental Heat Transfer; Heat Transfer Education; Visualization of Heat Transfer, 749-756, July 19–23, 2009

Paper No: HT2009-88087

DOI: https://doi.org/10.1115/HT2009-88087

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Topics: Simulation, Temperature, Junctions, Boundary-value problems, Fluid dynamics, Pressure

Proceedings Papers

Computational Study of Conjugate Heat Transfer in T-Junctions

Simon Kuhn, Bojan Nicˇeno, Horst-Michael Prasser

Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 889-896, July 19–23, 2009

Paper No: HT2009-88451

DOI: https://doi.org/10.1115/HT2009-88451

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Topics: Heat transfer, Junctions, Fatigue, Nuclear power stations, Water, Damping, Engineering simulation, Fluctuations (Physics), High temperature, Large eddy simulation

Proceedings Papers

Simulation of Charge Density and Field Distribution of a Gold Nanoparticle Tip-Terminated Scanning Nanowire Waveguide for Molecular Imaging

Nathan Malcolm, Alex J. Heltzel, Li Shi, John R. Howell

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 297-301, July 19–23, 2009

Paper No: HT2009-88351

DOI: https://doi.org/10.1115/HT2009-88351

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Topics: Density, Imaging, Nanoparticles, Nanowires, Simulation, Waveguides, Boundary-value problems, Cantilevers, Cell membranes, Coating processes

Proceedings Papers

Development of a Transparent Heater to Measure Surface Temperature Fluctuations for Pool Boiling and Spray Cooling

Alison R. Griffin, Arun Vijayakumar, Ruey-Hung Chen, Kalpathy B. Sundaram, Louis C. Chow

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 197-204, July 8–12, 2007

Paper No: HT2007-32218

DOI: https://doi.org/10.1115/HT2007-32218

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Topics: Cooling, Fluctuations (Physics), Pool boiling, Sprays, Temperature, Transparency, Bubbles, Junctions, Copper, Data acquisition systems

Proceedings Papers

Numerical Solution Methodology for Compact Thermal Models of Electronic Packages

Rohit Dev Gupta, Vinayak Eswaran

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 719-726, July 8–12, 2007

Paper No: HT2007-32139

DOI: https://doi.org/10.1115/HT2007-32139

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Topics: Electronic packages, Computational fluid dynamics, Convection, Junctions, Temperature, Algebra, Cooling, Fluid dynamics, Fluids, Heat transfer

Proceedings Papers

Thermal Interface Resistances in Nanostructures

Matthew Panzer, Ken Goodson

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 499-508, July 8–12, 2007

Paper No: HT2007-32412

DOI: https://doi.org/10.1115/HT2007-32412

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Topics: Nanostructures , Phonons, Heat conduction, Acoustics, Density, Dimensions, Junctions, Lattice dynamics, Molecular dynamics, Photonic equipment

Proceedings Papers

Development of Thermal-Hydraulic Code Coupled With Heat Conduction in Structure for Thermal Striping Phenomena: Development of Calculation Module for Temperature Distribution in Structure

Masa-Aki Tanaka, Hiroyuki Ohshima

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 239-245, July 8–12, 2007

Paper No: HT2007-32720

DOI: https://doi.org/10.1115/HT2007-32720

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Topics: Heat conduction, Temperature distribution, Computer simulation, Evaluation methods, Fluids, Temperature, Transient heat transfer, Breeder reactors, Computation, Computational methods

Proceedings Papers

Optimal Package Design of Stacks of Convection-Cooled Printed Circuit Boards Using Entropy Generation Minimization Method

Wen Jei Yang, Takahiro Furukawa, Shuichi Torii

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 479-485, July 8–12, 2007

Paper No: HT2007-32195

DOI: https://doi.org/10.1115/HT2007-32195

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Topics: Convection, Design, Entropy, Printed circuit boards, Optimization, Electronic packages, Geometry, Reynolds number, Channel flow, Cooling

Proceedings Papers

Experimental Study on Turbulent Flow and Mixing in Counter-Flow Type T-Junction

Masafumi Hirota, Hiroshi Nakayama, Sayaka Koide, Ippei Takeuchi

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 1099-1106, July 8–12, 2007

Paper No: HT2007-32777

DOI: https://doi.org/10.1115/HT2007-32777

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Topics: Flow (Dynamics), Junctions, Turbulence, Cycles, Fatigue, Oscillations

Proceedings Papers

Thermal Transport Measurements of Nanowire-Substrate Interfaces

Monalisa Mazumder, Theodorian Borca-Tasciuc

Proc. ASME. HT2008, Heat Transfer: Volume 1, 365-368, August 10–14, 2008

Paper No: HT2008-56328

DOI: https://doi.org/10.1115/HT2008-56328

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Topics: Nanowires, Atomic force microscopy, Nanostructures , Thermal resistance, Cantilevers, Conductive coatings, Data acquisition, Electrodes, Imaging, Junctions

Proceedings Papers

Temperature Modeling for Carbon Nanofiber Breakdown

Drazen Fabris, Hirohiko Kitsuki, Toshishige Yamada, Xuhui Sun, Jorge Gonzalez Cruz, Cary Y. Yang

Proc. ASME. HT2008, Heat Transfer: Volume 1, 357-363, August 10–14, 2008

Paper No: HT2008-56244

DOI: https://doi.org/10.1115/HT2008-56244

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Topics: Carbon, Modeling, Nanofibers, Temperature, Electrodes, Heat, Junctions, Oxidation

Proceedings Papers

Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency

Amip J. Shah, Anita Rogacs, Chandrakant D. Patel

Proc. ASME. HT2008, Heat Transfer: Volume 2, 653-662, August 10–14, 2008

Paper No: HT2008-56210

DOI: https://doi.org/10.1115/HT2008-56210

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Topics: Computers, Energy efficiency, Optimization, Thermal management, Cooling, Data centers, Density, Energy consumption, Temperature, Compacting

NARROW

Thermal Mixing Downstream of a 90-Degree T-Junction: Laminar and Turbulent Flows

An Investigation on Mechanism of Droplet Generation in High Inertial Gaseous Flow

Two-Phase Flow Patterns in Microfluidic Cross-Shaped Junctions and Slug Hydrodynamics in the Dripping Regime

Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles

Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness

Microscale Phase Separation Through Nanoporous Membranes

Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction

Heat Dissipation Mechanism at Supported CNT-CNT Junctions

One-Dimensional Simulation of a Stirling Three-Stage Pulse-Tube Refrigerator

Computational Study of Conjugate Heat Transfer in T-Junctions

Simulation of Charge Density and Field Distribution of a Gold Nanoparticle Tip-Terminated Scanning Nanowire Waveguide for Molecular Imaging

Development of a Transparent Heater to Measure Surface Temperature Fluctuations for Pool Boiling and Spray Cooling

Numerical Solution Methodology for Compact Thermal Models of Electronic Packages

Thermal Interface Resistances in Nanostructures

Development of Thermal-Hydraulic Code Coupled With Heat Conduction in Structure for Thermal Striping Phenomena: Development of Calculation Module for Temperature Distribution in Structure

Optimal Package Design of Stacks of Convection-Cooled Printed Circuit Boards Using Entropy Generation Minimization Method

Experimental Study on Turbulent Flow and Mixing in Counter-Flow Type T-Junction

Thermal Transport Measurements of Nanowire-Substrate Interfaces

Temperature Modeling for Carbon Nanofiber Breakdown

Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency

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