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Proceedings Papers

CFD Modeling of Thermal Management Systems for a Silicon Semiconductor Switch

Jordan N. Berg, Sarvenaz Sobhansarbandi

Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T09A011, July 13–15, 2020

Paper No: HT2020-9060

DOI: https://doi.org/10.1115/HT2020-9060

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Topics: Computational fluid dynamics, Microchannels, Modeling, Semiconductors (Materials), Silicon, Switches, Thermal management

Proceedings Papers

Quantum Dot Temperature Sensor Ab Initio Test: Droplet Vaporization Heat Transfer

Husain Al Hashimi, Jungho Kim

Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A012, July 10–14, 2016

Paper No: HT2016-7164

DOI: https://doi.org/10.1115/HT2016-7164

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Topics: Drops, Heat transfer, Quantum dots, Temperature sensors, Excitation, Complementary metal oxide semiconductors, Ethanol, Evaporation, Resolution (Optics), Semiconductors (Materials)

Proceedings Papers

Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling

Francesco Agostini, Thomas Gradinger, Didier Cottet

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A015, July 14–19, 2013

Paper No: HT2013-17058

DOI: https://doi.org/10.1115/HT2013-17058

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Topics: Computer cooling, Condensers (steam plant), Cooling, Flow (Dynamics), Fluids, Gravity (Force), Heat sinks, Pressure drop, Refrigerants, Semiconductors (Materials)

Proceedings Papers

An Evaluation of Energy Transfer Pathways in Thermal Transport Across Solid/Solid Interfaces

Yan Wang, Xiulin Ruan

Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A041, July 14–19, 2013

Paper No: HT2013-17297

DOI: https://doi.org/10.1115/HT2013-17297

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Topics: Electrons, Energy transformation, Heat, Heat transfer, High temperature, Interfacial thermal resistance, Metallic thin films, Metals, Phonons, Semiconductor wafers

Proceedings Papers

Multi-Parametric Growth of Semiconductor Nanowires in a Single Platform by Laser-Induced Localized Heat Sources

David J. Hwang, Sang-Gil Ryu, Eunpa Kim, Costas P. Grigoropoulos

Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 943-946, July 8–12, 2012

Paper No: HT2012-58315

DOI: https://doi.org/10.1115/HT2012-58315

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Topics: Heat, Lasers, Nanowires, Semiconductors (Materials), Energy gap, Heating, Irradiation (Radiation exposure), Laser beams, Manufacturing, Nanoscale phenomena

Proceedings Papers

Quantifying Uncertainty in Multiscale Heat Conduction Calculations

Prabhakar Marepalli, Bo Qiu, Xiulin Ruan, Jayathi Y. Murthy

Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 1095-1104, July 8–12, 2012

Paper No: HT2012-58523

DOI: https://doi.org/10.1115/HT2012-58523

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Topics: Heat conduction, Uncertainty, Computation, Temperature, Engineering simulation, Simulation, Thermal conductivity, Relaxation (Physics), Density, Noise (Sound)

Proceedings Papers

Thermal Resistance of Silicon/Germanium Interfaces From Lattice Dynamics Calculations

E. S. Landry, A. J. H. McGaughey

Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 29-32, July 19–23, 2009

Paper No: HT2009-88025

DOI: https://doi.org/10.1115/HT2009-88025

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Topics: Germanium, Lattice dynamics, Silicon, Thermal resistance, Electromagnetic scattering, Phonons, Radiation scattering, Scattering (Physics), Density, Design

Proceedings Papers

Low Temperature, All-Inorganic Nanoparticle Solution Process for ZnO Nanowire Network Transistor Fabrication on a Polymer Substrate

Seung Hwan Ko, Inkyu Park, Heng Pan, Nipun Misra, Costas P. Grigoropoulos

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 771-775, July 19–23, 2009

Paper No: HT2009-88062

DOI: https://doi.org/10.1115/HT2009-88062

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Topics: Low temperature, Manufacturing, Nanoparticles, Nanowires, Polymers, Transistors, Metals, Active materials, Electrodes, Electronics

Proceedings Papers

Thin Film Phonon Heat Conduction by the Dispersion Lattice Boltzmann Method

Rodrigo A. Escobar, Cristina H. Amon, Amador M. Guzma´n

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 257-266, July 8–12, 2007

Paper No: HT2007-32130

DOI: https://doi.org/10.1115/HT2007-32130

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Topics: Heat conduction, Lattice Boltzmann methods, Phonons, Thin films, Computer simulation, Thermal conductivity, Thermal energy transport, Acoustics, Mean free path, Semiconductors (Materials)

Proceedings Papers

Electro-Thermal Analysis of Submicron Si MOSFET With Zoned Mesh Based on Semiconductor Physics Theory

Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 771-778, July 8–12, 2007

Paper No: HT2007-32745

DOI: https://doi.org/10.1115/HT2007-32745

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Topics: MOSFET transistors, Physics, Semiconductors (Materials), Electrodes, Errors, Gates (Closures)

Proceedings Papers

A Study on the Heat Transfer Enhancement in Magnetron Sputtering System

Jae-Sang Baik, Youn-Jea Kim

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 315-320, July 8–12, 2007

Paper No: HT2007-32182

DOI: https://doi.org/10.1115/HT2007-32182

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Topics: Heat transfer, Sputtering (Irradiation), Flow (Dynamics), Cooling, Cooling systems, Water, Algorithms, Damage, Electric current, Finite volume methods

Proceedings Papers

Atomic-Scale Three-Dimensional Phononic Crystals With a Lower Thermal Conductivity Than the Einstein Limit of Bulk Silicon

Jean-Numa Gillet, Yann Chalopin, Sebastian Volz

Proc. ASME. HT2008, Heat Transfer: Volume 1, 25-34, August 10–14, 2008

Paper No: HT2008-56403

DOI: https://doi.org/10.1115/HT2008-56403

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Topics: Phononic crystals, Silicon, Thermal conductivity, Nanoparticles, Nanomaterials, Self-assembly, Superlattices, Atoms, Complementary metal oxide semiconductors, Design

Proceedings Papers

Modeling of Subcontinuum Thermal Transport Across Semiconductor-Gas Interfaces

Dhruv Singh, Xiaohui Guo, Alina Alexeenko, Jayathi Y. Murthy, Timothy S. Fisher

Proc. ASME. HT2008, Heat Transfer: Volume 1, 389-400, August 10–14, 2008

Paper No: HT2008-56427

DOI: https://doi.org/10.1115/HT2008-56427

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Topics: Modeling, Semiconductors (Materials), Phonons, Equilibrium (Physics), Heat transfer, Temperature, Algorithms, Electrical conductance, Energy budget (Physics), Gas flow

Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks

Tohru Suwa, Hamid Hadim

Proc. ASME. HT2008, Heat Transfer: Volume 2, 779-787, August 10–14, 2008

Paper No: HT2008-56056

DOI: https://doi.org/10.1115/HT2008-56056

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Topics: Design, Electrical wires, Heat, Optimization, Semiconductors (Materials)

Proceedings Papers

Drawdown-Effect of Lightpipes in Silicon Wafer Surface Temperature Measurements

Yan Qu, Ekachai Puttitwong, John R. Howell, Ofodike A. Ezekoye, Kenneth S. Ball

Proc. ASME. HT2005, Heat Transfer: Volume 4, 193-198, July 17–22, 2005

Paper No: HT2005-72203

DOI: https://doi.org/10.1115/HT2005-72203

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Topics: Semiconductor wafers, Temperature measurement, Temperature, Semiconductors (Materials), Uncertainty, Calibration, Radiation (Physics), Thermometers

Proceedings Papers

Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling

Xuejiao Hu, Ravi Prasher, Kenneth Goodson

Proc. ASME. HT2005, Heat Transfer: Volume 4, 963-966, July 17–22, 2005

Paper No: HT2005-72729

DOI: https://doi.org/10.1115/HT2005-72729

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Topics: Computer cooling, Heat conduction, Packaging, Composite materials, Polymers, Semiconductors (Materials), Thermal resistance, Thin films

Proceedings Papers

Feature Evolution During Sub 100NM Gap-Fill and Etch

Hemant Mungekar, Young S. Lee, Shankar Venkataraman

Proc. ASME. HT2005, Heat Transfer: Volume 3, 221-224, July 17–22, 2005

Paper No: HT2005-72326

DOI: https://doi.org/10.1115/HT2005-72326

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Topics: Etching, Pressure, Plasmas (Ionized gases), Design, Electric fields, Electronics, Integrated circuit fabrication, Ions, Plasma density, Process design

Proceedings Papers

Torque Transient of Magnetically Driven Flow for Viscosity Measurement

Heng Ban, Bochuan Lin, Chao Li, Rosalia N. Scripa, Ching-Hua Su, Sandor L. Lehoczky

Proc. ASME. HT-FED2004, Volume 1, 509-513, July 11–15, 2004

Paper No: HT-FED2004-56715

DOI: https://doi.org/10.1115/HT-FED2004-56715

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Topics: Flow (Dynamics), Torque, Transients (Dynamics), Viscosity measurement, Oscillations, Semiconductors (Materials), Viscosity, Chain, Fluid dynamics, Fluids

Proceedings Papers

Micro- and Nanoscale Phonon Heat Transport in Silicon

Y. Ju

Proc. ASME. HT-FED2004, Volume 4, 631-638, July 11–15, 2004

Paper No: HT-FED2004-56743

DOI: https://doi.org/10.1115/HT-FED2004-56743

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Topics: Heat, Nanoelectronics, Nanoscale phenomena, Nanowires, Phonons, Semiconductors (Materials), Silicon

Proceedings Papers

Computations of Sub-Micron Heat Transport in Silicon Accounting for Phonon Dispersion

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. HT2003, Heat Transfer: Volume 1, 569-578, July 21–23, 2003

Paper No: HT2003-47490

DOI: https://doi.org/10.1115/HT2003-47490

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Topics: Accounting, Computation, Heat, Phonons, Silicon, Acoustics, Temperature, Dielectric materials, Diffusion (Physics), Electromagnetic spectrum

NARROW

CFD Modeling of Thermal Management Systems for a Silicon Semiconductor Switch

Quantum Dot Temperature Sensor Ab Initio Test: Droplet Vaporization Heat Transfer

Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling

An Evaluation of Energy Transfer Pathways in Thermal Transport Across Solid/Solid Interfaces

Multi-Parametric Growth of Semiconductor Nanowires in a Single Platform by Laser-Induced Localized Heat Sources

Quantifying Uncertainty in Multiscale Heat Conduction Calculations

Thermal Resistance of Silicon/Germanium Interfaces From Lattice Dynamics Calculations

Low Temperature, All-Inorganic Nanoparticle Solution Process for ZnO Nanowire Network Transistor Fabrication on a Polymer Substrate

Thin Film Phonon Heat Conduction by the Dispersion Lattice Boltzmann Method

Electro-Thermal Analysis of Submicron Si MOSFET With Zoned Mesh Based on Semiconductor Physics Theory

A Study on the Heat Transfer Enhancement in Magnetron Sputtering System

Atomic-Scale Three-Dimensional Phononic Crystals With a Lower Thermal Conductivity Than the Einstein Limit of Bulk Silicon

Modeling of Subcontinuum Thermal Transport Across Semiconductor-Gas Interfaces

Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks

Drawdown-Effect of Lightpipes in Silicon Wafer Surface Temperature Measurements

Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling

Feature Evolution During Sub 100NM Gap-Fill and Etch

Torque Transient of Magnetically Driven Flow for Viscosity Measurement

Micro- and Nanoscale Phonon Heat Transport in Silicon

Computations of Sub-Micron Heat Transport in Silicon Accounting for Phonon Dispersion

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