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Keywords: electronics cooling
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Proceedings Papers

Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T12A003, July 11–13, 2022
Paper No: HT2022-81617
..., electronics cooling, jet, impingement cooling, NOMENCLATURE Al Test section area, m2 CCD Charge coupled device h Heat transfer coefficient, W/(m2·K) I Current, A L Lh Hydraulic diameter of the channel, m LCT Liquid crystal thermography Nu Nusselt number q Heat flux, W/m2 T Temperature, , K U Voltage, V Greek...
Proceedings Papers

Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A002, July 11–13, 2022
Paper No: HT2022-85400
...Proceedings of the ASME 2022 Heat Transfer Summer Conference HT2022 July 11-13, 2022, Philadelphia, Pennsylvania HT2022-85400 Optimal Design of Additively Manufactured Metal Lattice Heat Sinks for Electronics Cooling Bharath Bharadwaj Mechanical Engineering Dept. Virginia Tech Blacksburg, VA...
Proceedings Papers

Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T10A008, July 14–17, 2019
Paper No: HT2019-3651
... supply to the evaporator. A latent heat flux of approximately 6.7 W/cm2 is absorbed per unit area of the evaporator during the device startup phase. Keywords: electronics cooling, thermal management, loop heat pipe, capillary pumped loop, microfluidics INTRODUCTION Thermal management or electronics...
Proceedings Papers

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A017, July 14–19, 2013
Paper No: HT2013-17182
..., multiple-channel heat sink system. Recommendations for moving toward an optimum geometry, based on thermal performance and agitator power are made. Electronics cooling agitation heat sink aspect ratio EFFECTS OF CHANNEL ASPECT RATIO ON CONVECTIVE HEAT TRANSFER IN AN ELECTRONICS COOLING HEAT...
Proceedings Papers

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A011, July 14–19, 2013
Paper No: HT2013-17769
... of approximately 35m/s from 92, 0.9 mm × 0.9 mm orifices. The results give guidance to those who face a similar interference problem and are considering displacement of the synthetic jet assembly. Electronics cooling synthetic jets heat sink heat transfer enhancement 1 Copyright © 2013 by ASME HEAT...
Proceedings Papers

Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 659-666, July 8–12, 2012
Paper No: HT2012-58278
... flow is of a low velocity compared to the synthetic jet peak velocity (as low as 4 m/s in the present study). synthetic jet heat transfer enhancement electronics cooling heat sink 1 Copyright © 2012 by ASME HEAT TRANSFER ENHANCEMENT BY SYNTHETIC JET ARRAYS IN AIR-COOLED HEAT SINKS FOR USE...
Proceedings Papers

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 917-923, July 19–23, 2009
Paper No: HT2009-88337
... Piezoelectric fans have been investigated for electronics cooling over the last several decades. The primary usage of these meso scale-vibrating fans has been to create sweeping flows over the heated surfaces. In this paper, an experimental study to understand the heat transfer behavior...
Proceedings Papers

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 821-828, July 19–23, 2009
Paper No: HT2009-88216
... the jet orifice was measured, and the calculated pressure loss coefficients agree well with available correlations. Curve fits for the Nusselt number and pressure loss coefficient are given. electronics cooling microscale jet heat transfer microjet orifice pressure loss coefficient 1...
Proceedings Papers

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 955-962, July 19–23, 2009
Paper No: HT2009-88440
... and jet-to-surface spacing, resulting in about 90% enhancement of the maximum and overall cooling rate compared to a single jet, without the need for external cross-flow forcing. synthetic jet impinging jet vectoring cross-flow electronics cooling particle image velocimetry HEAT TRANSFER...
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 267-274, July 8–12, 2007
Paper No: HT2007-32537
... 1 Copyright © 2007 by ASME Proceedings of HT2007 2007 ASME-JSME Thermal Engineering Summer Heat Transfer Conference July 8-12, 2007, Vancouver, British Columbia, CANADA HT2007-32537 AN EXPERIMENTAL CHARACTERISATION OF MINIATURE SCALE COLD PLATES FOR ELECTRONICS COOLING APPLICATIONS N. Jeffers...
Proceedings Papers

Proc. ASME. HT2008, Heat Transfer: Volume 2, 671-677, August 10–14, 2008
Paper No: HT2008-56405
..., electronics cooling, volumetric COP, heat sink oscillating fan s range of motion. The area with the largest oscillations is the free end of the cantilever beam and does not have the piezoceramic material in that region. PIEZOELECTRIC FANS: HEAT TRANSFE COO James Petroski GE Lumination Valley View, OH Mehme GE...
Proceedings Papers

Proc. ASME. HT2008, Heat Transfer: Volume 2, 327-334, August 10–14, 2008
Paper No: HT2008-56471
... And Refrigeration y, Stockholm, Sweden rak, Mamoun Muhammed mmunication Technology nal Materials y, Stockholm, Sweden KEYWORDS Thermosyphon, electronics cooling, enhanced boiling, nano- and micro-structures, porous networks, two-phase heat transfer, micro-channels, R134A, high speed visualization. NOMENCLATURE...
Proceedings Papers

Proc. ASME. HT2008, Heat Transfer: Volume 2, 341-352, August 10–14, 2008
Paper No: HT2008-56105
... of the overall dimensions as the FHP. Keywords: Flat heat pipe, Transient, Electronics cooling, Hydrodynamic model NOMENCLATURE A area, m mass flow rate, kg m-3 Cp specific heat capacity, Jkg-1K-1 density, kgm-3 H thickness, m surface tension, N m-1 Proceedings of 2008 ASME Summer Heat transfer Conferen...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 2, 195-205, July 17–22, 2005
Paper No: HT2005-72666
... of the surface and to be well predicted by a correlation available in the literature. boiling channel confinement electronics cooling Proceedings of HT2005 2005 ASME Summer Heat Transfer Conference ro Fl be co co IN di re so in Fl te m as pr co co Proceedings of HT2005 2005 ASME Summer Heat Transfer...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 4, 511-517, July 17–22, 2005
Paper No: HT2005-72207
... surface. Test data indicating an evaporator thermal resistance of 0.080 cm 2 ·°C/W at 290W/cm 2 are presented. Heat pipe thermal resistance coefficient of thermal expansion silicon electronics cooling test artic copper/mo Test data i cm2·ºC/W KEYWOR Heat expansion, NOMENC A = cross s BLT...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 4, 715-719, July 17–22, 2005
Paper No: HT2005-72069
... Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems . Heat Pipe Remote Heat Exchanger Electronics Cooling Notebook Mobile Proceedings of HT2005: ASME Summer Heat Transfer Conference Proceedings of HT2005 2005 ASME Summer Heat Transfer Conference 1...
Proceedings Papers

Proc. ASME. HT2003, Heat Transfer: Volume 3, 507-517, July 21–23, 2003
Paper No: HT2003-47349
... found increasingly widespread use in electronics cooling applications. With chip-level heat fluxes reaching 75-100 W/cm2, heat pipes provide an attractive passive alternative for use as heat spreaders and to transport heat to remote heat sinks for dissipation. Though a variety of analytical...
Proceedings Papers

Proc. ASME. HT2003, Heat Transfer: Volume 3, 535-539, July 21–23, 2003
Paper No: HT2003-47376
..., the total power dissipated increases with both Reynolds number and component spacing. As in natural convection, the relative location of the electrical sources and the positioning of the sources are found to have a strong influence on power dissipation. Electronics Cooling Opto-Electronics High Heat...