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Keywords: thermal resistance
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Proceedings Papers

Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T06A002, June 16–18, 2021
Publisher: American Society of Mechanical Engineers
Paper No: HT2021-62804
... was v velocity in the y-direction (m/s) conducted. The effect of the sine wave frequency, the pin fins' w velocity in the z-direction (m/s) diameter, and the hydraulic diameter of the microchannel are studied. The results are quantified in terms of thermal resistance GREEK ALPHABETS and pressure drop...
Proceedings Papers

Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T05A003, June 16–18, 2021
Publisher: American Society of Mechanical Engineers
Paper No: HT2021-63099
... is studied. The studies are performed for Reynolds w velocity in the z-direction (m/s) numbers varying from 250 to 2000, and the results are quantified based on thermal resistance and pressure drop. The heat sinks GREEK ALPHABETS embedded with pin fins have better performance in terms of µ viscosity (Pa.s...
Proceedings Papers

Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T04A009, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-9153
... for envelopes with improved thermal resistance. Although space conditioning energy needs are strongly affected by occupant behavior, simulations generally ignore the temporal occupant behavior in estimating the energy needed for heating and cooling. Vigorous conservation tactics, which produce a thermal...
Proceedings Papers

Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 593-599, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58064
... with both ferrofluids. Open Loop Pulsating Heat Pipes (OLPHPs) Ferrofluid Surface coating Thermal resistance Effects of Surface Coating of Nanoparticles on Thermal Performance of Open Loop Pulsating Heat Pipes Mehdi, Taslimifar, Center of Excellence in Energy Conversion School of Mechanical...
Proceedings Papers

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 747-754, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88036
... thermal specification of the chipset microprocessor. The study also focuses on the system-level assessment of the optimum 60×40 mm 2 footprint and corner cases by studying the effect of motherboard thermal conductivity as well as blockages on the heatsink case-to-ambient thermal resistance. Low...
Proceedings Papers

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 675-683, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88381
... 23 02 2010 In this paper, the effect of several different parameters on the thermal resistance of a Closed Loop Pulsating Heat Pipe (CLPHP) has been investigated. These parameters include the working fluid, the inclination angle, the filling ratio and the heat influx. Also, the impact...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 4, 577-582, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72091
... Thermal resistance Fin height Fin-to-spacing ratio Conjugate heat transfer A numerical study has been carried out to examine the conjugate heat transfer under a confined impinging jet using a plate-fin heat sink as the target plate. Effects of geometric parameters such as fin number...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 4, 511-517, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72207
... surface. Test data indicating an evaporator thermal resistance of 0.080 cm 2 ·°C/W at 290W/cm 2 are presented. Heat pipe thermal resistance coefficient of thermal expansion silicon electronics cooling test artic copper/mo Test data i cm2·ºC/W KEYWOR Heat expansion, NOMENC A = cross s BLT...