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Proceedings Papers

Proceedings Volume Cover
ASME 2006 International Mechanical Engineering Congress and Exposition
November 5–10, 2006
Chicago, Illinois, USA
Conference Sponsors:
  • Heat Transfer Division
Heat Transfer, Volume 3

Heat Transfer

K16 Committee: Heat Transfer in Electronic Equipment

Topics: Nanowires

K18 Committee: Low Temperature

K19 Committee: Environmental Heat Transfer

K20 Committee: Computational Heat Transfer

K21 Committee: Education

K22 Committee: Visualization of Heat Transfer

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