Water block and thermoelectric cooler (TEC) are two of the main components in a peltier-based cooling solutions. An optimized water block design and high performance TEC are the key to having a good peltier-based cooling solution. In this study, experimental investigations were performed on small form-factor peltier-based cooling solutions designed for high density electronics. The experiments were conducted in four incremental steps in evaluating the thermal performance of water block with different manufacturing options, different sizes and capabilities of the off-the-shelf TECs, TECs’ optimal operating voltage, thermal performance of the peltier-based liquid cooling solutions, and finally the reliability of the TECs through temperature cycling.
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ASME 2016 International Mechanical Engineering Congress and Exposition
November 11–17, 2016
Phoenix, Arizona, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5064-0
PROCEEDINGS PAPER
Small Form Factor Peltier-Based Liquid Cooling for High Power Density Electronics
Arunima Panigrahy,
Arunima Panigrahy
Intel Corporation, Santa Clara, CA
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Ying Feng Pang,
Ying Feng Pang
Intel Corporation, Santa Clara, CA
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Victor P. Polyanko
Victor P. Polyanko
Intel Corporation, Santa Clara, CA
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Arunima Panigrahy
Intel Corporation, Santa Clara, CA
Ying Feng Pang
Intel Corporation, Santa Clara, CA
Amy Xia
Intel Corporation, Santa Clara, CA
Victor P. Polyanko
Intel Corporation, Santa Clara, CA
Paper No:
IMECE2016-65680, V010T13A051; 6 pages
Published Online:
February 8, 2017
Citation
Panigrahy, A, Pang, YF, Xia, A, & Polyanko, VP. "Small Form Factor Peltier-Based Liquid Cooling for High Power Density Electronics." Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exposition. Volume 10: Micro- and Nano-Systems Engineering and Packaging. Phoenix, Arizona, USA. November 11–17, 2016. V010T13A051. ASME. https://doi.org/10.1115/IMECE2016-65680
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