Water block and thermoelectric cooler (TEC) are two of the main components in a peltier-based cooling solutions. An optimized water block design and high performance TEC are the key to having a good peltier-based cooling solution. In this study, experimental investigations were performed on small form-factor peltier-based cooling solutions designed for high density electronics. The experiments were conducted in four incremental steps in evaluating the thermal performance of water block with different manufacturing options, different sizes and capabilities of the off-the-shelf TECs, TECs’ optimal operating voltage, thermal performance of the peltier-based liquid cooling solutions, and finally the reliability of the TECs through temperature cycling.

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