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Proceedings Papers

Correlation of Measured Shoe Forces and Surface Quality in Centerless Grinding

Richard W. Monahan, D. Michael McFarland

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 313-320, November 16–21, 1997

Paper No: IMECE1997-1167

DOI: https://doi.org/10.1115/IMECE1997-1167

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Topics: Grinding, Surface quality, Machinery, Cycles, Finishes, Grinding wheels, Steady state

Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997

Paper No: IMECE1997-1108

DOI: https://doi.org/10.1115/IMECE1997-1108

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Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption

Proceedings Papers

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

Waldyr L. R. Gallo, Jorge Llagostera, Arnaldo C. S. Walter

Proc. ASME. IMECE97, Advanced Energy Systems, 231-238, November 16–21, 1997

Paper No: IMECE1997-0993

DOI: https://doi.org/10.1115/IMECE1997-0993

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Topics: Cycles, Fuels, Thermoeconomics, Water, Compressors, Pressure, Alloys, Blades, Cooling, Economic analysis

Proceedings Papers

Lumped Parameter Thermodynamic and Heat Transfer Modeling of a Scroll Pump

Sankar Sunder, Joseph L. Smith, Jr.

Proc. ASME. IMECE97, Advanced Energy Systems, 417-427, November 16–21, 1997

Paper No: IMECE1997-1015

DOI: https://doi.org/10.1115/IMECE1997-1015

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Topics: Heat transfer, Modeling, Pumps, Compression, Cycles, Displacement, Engines, Flow (Dynamics), Geometry, Heat conduction

Proceedings Papers

An Analysis of the Major Variables Impacting Performance of Absorption Chillers and Heat Pumps

Keith E. Herold

Proc. ASME. IMECE97, Advanced Energy Systems, 349-356, November 16–21, 1997

Paper No: IMECE1997-1007

DOI: https://doi.org/10.1115/IMECE1997-1007

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Topics: Absorption, Heat pumps, Heat, Temperature, Cycles, Machinery, Heat transfer, Machine design, Modeling, Shapes

Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997

Paper No: IMECE1997-1231

DOI: https://doi.org/10.1115/IMECE1997-1231

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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

Recurrent Artificial Neural Networks for Crashworthiness Analysis

Tarek A. Omar, Nabih E. Bedewi, Azim Eskandarian

Proc. ASME. IMECE97, Crashworthiness, Occupant Protection and Biomechanics in Transportation Systems, 109-118, November 16–21, 1997

Paper No: IMECE1997-1190

DOI: https://doi.org/10.1115/IMECE1997-1190

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Topics: Artificial neural networks, Crashworthiness, Displacement, Simulation, Vehicles, Finite element analysis, Cycles, Dynamic systems, Dynamics (Mechanics), Equations of motion

Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-1215

DOI: https://doi.org/10.1115/IMECE1997-1215

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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

Numerical Analysis of Oscillatory Flow and Gas Transport Through a Bifurcating Airway Model

Hideki Fujioka, Kotaro Oka, Kazuo Tanishita

Proc. ASME. IMECE97, Advances in Bioengineering, 43-44, November 16–21, 1997

Paper No: IMECE1997-0219

DOI: https://doi.org/10.1115/IMECE1997-0219

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Topics: Flow (Dynamics), Numerical analysis, Resonance, Bifurcation, Cycles, Fluids, Geometry, Navier-Stokes equations, Reynolds number, Ventilation

Proceedings Papers

Effects of Varying Strain Amplitudes and Cyclic Loads on the Tensile Behavior of the IGHL

Vincent M. Wang, Chun-Yuh Huang, Nathaniel P. Cohen, Robert J. Pawluk, John S. Bucchieri, Evan L. Flatow, Louis U. Bigliani, Roger G. Pollock, Van C. Mow

Proc. ASME. IMECE97, Advances in Bioengineering, 193-194, November 16–21, 1997

Paper No: IMECE1997-0294

DOI: https://doi.org/10.1115/IMECE1997-0294

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Topics: Stress, Biological tissues, Cycles, Dislocations, Glenohumeral ligaments, Tensile testing

Proceedings Papers

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 41-47, November 16–21, 1997

Paper No: IMECE1997-0498

DOI: https://doi.org/10.1115/IMECE1997-0498

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Topics: Cantilever beams, Cycles, Delamination, Displacement, Failure, Fatigue, Fatigue testing, Fibers, Flow (Dynamics), Fracture (Materials)

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Sam Y. Zamrik, Mark L. Renauld

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 333-345, November 16–21, 1997

Paper No: IMECE1997-0549

DOI: https://doi.org/10.1115/IMECE1997-0549

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Topics: Fatigue life, Gas turbines, Thermomechanics, Cycles, Temperature, Creep, Fatigue, Nickel, Superalloys

Proceedings Papers

On the Performance vs. Energy Consumption Tradeoff With Semi-Active Vibration Control Using an MR-Fluid Damper

Jin Kyoo Lee, William W. Clark, Sung Hwan Kim

Proc. ASME. IMECE97, Active/Passive Vibration Control and Nonlinear Dynamics of Structures, 55-60, November 16–21, 1997

Paper No: IMECE1997-0559

DOI: https://doi.org/10.1115/IMECE1997-0559

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Topics: Dampers, Energy consumption, Fluids, Tradeoffs, Vibration control, Vibration, Cycles, Excitation, Vibration suppression

Proceedings Papers

A Simple Method for Estimating Railcar Wheel Tread Temperature Rise During Braking

G. J. Moyar, F. G. Carlson

Proc. ASME. IMECE97, Rail Transportation, 65-74, November 16–21, 1997

Paper No: IMECE1997-0594

DOI: https://doi.org/10.1115/IMECE1997-0594

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Topics: Braking, Temperature, Wheels, Drag (Fluid dynamics), Trains, Brakes, Computational methods, Computer software, Cycles, Engineering simulation

Proceedings Papers

Semi-Empirical Process Modeling: Model and Database Integration

H. P. Wang, Erin M. Perry, Martin K. Lee

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 51-65, November 16–21, 1997

Paper No: IMECE1997-0619

DOI: https://doi.org/10.1115/IMECE1997-0619

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Topics: Databases, Modeling, Plastics, Tooling, Cycles, Design, Engineers, Extruding, Injection molding, Product design

Proceedings Papers

Integrated Simulations of Structural Performance, Molding Process and Warpage for Gas-Assisted Injection Molded Parts

Shia-Chung Chen, Nien-Tien Cheng, Sheng-Yan Hu

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 15-32, November 16–21, 1997

Paper No: IMECE1997-0617

DOI: https://doi.org/10.1115/IMECE1997-0617

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Topics: Engineering simulation, Molding, Simulation, Warping, Geometry, Algorithms, Boundary element methods, Computer-aided engineering, Cooling, Cycles

Proceedings Papers

The Influence of Processing on Structural Behaviour: An Interface Between Moldflow and ABAQUS

Wim Bruijs, Rob Brounné

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 97-106, November 16–21, 1997

Paper No: IMECE1997-0622

DOI: https://doi.org/10.1115/IMECE1997-0622

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Topics: Accounting, Computer-aided engineering, Cycles, Design, Finite element analysis, Geometry, Injection molding, Jigs and fixtures, Molding, Shapes

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Correlation of Measured Shoe Forces and Surface Quality in Centerless Grinding

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

Lumped Parameter Thermodynamic and Heat Transfer Modeling of a Scroll Pump

An Analysis of the Major Variables Impacting Performance of Absorption Chillers and Heat Pumps

Testing and Measurement Techniques Applied to Electronic Packaging Development

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Recurrent Artificial Neural Networks for Crashworthiness Analysis

Transient Thermal Analysis of Outdoor Electronic Equipment

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Numerical Analysis of Oscillatory Flow and Gas Transport Through a Bifurcating Airway Model

Effects of Varying Strain Amplitudes and Cyclic Loads on the Tensile Behavior of the IGHL

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

On the Performance vs. Energy Consumption Tradeoff With Semi-Active Vibration Control Using an MR-Fluid Damper

A Simple Method for Estimating Railcar Wheel Tread Temperature Rise During Braking

Semi-Empirical Process Modeling: Model and Database Integration

Integrated Simulations of Structural Performance, Molding Process and Warpage for Gas-Assisted Injection Molded Parts

The Influence of Processing on Structural Behaviour: An Interface Between Moldflow and ABAQUS

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