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Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997

Paper No: IMECE1997-1108

DOI: https://doi.org/10.1115/IMECE1997-1108

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Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption

Proceedings Papers

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Arun Majumdar, John Varesi

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 171-179, November 16–21, 1997

Paper No: IMECE1997-0955

DOI: https://doi.org/10.1115/IMECE1997-0955

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Topics: Joules, Microscopy, Nanoscale phenomena, Temperature measurement, Atomic force microscopy, Imaging, Metals, Resolution (Optics), Signals, Temperature distribution

Proceedings Papers

Optimization of a Simplified Vapor Adsorption Cycle

M. Ramotowski, N. Shamsundar

Proc. ASME. IMECE97, Advanced Energy Systems, 95-102, November 16–21, 1997

Paper No: IMECE1997-0978

DOI: https://doi.org/10.1115/IMECE1997-0978

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Topics: Cycles, Optimization, Vapors, Flow (Dynamics), Heating, Heat pumps, Temperature, Thermal analysis, Thermodynamic cycles, Water

Proceedings Papers

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 75-81, November 16–21, 1997

Paper No: IMECE1997-1216

DOI: https://doi.org/10.1115/IMECE1997-1216

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Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability

Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-1215

DOI: https://doi.org/10.1115/IMECE1997-1215

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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability

Proceedings Papers

An Experimental Investigation of Steam Injection in Fractured Porous Media

Glenn. E. McCreery, Richard C. Martineau

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 333-340, November 15–20, 1998

Paper No: IMECE1998-0668

DOI: https://doi.org/10.1115/IMECE1998-0668

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Topics: Porous materials, Steam, Water, Condensation, Condensed matter, Flow (Dynamics), Pressure, Pumps, Rivers, Thermal analysis

Proceedings Papers

Blood Vessel Network Generation for Thermal Modeling of Living Tissue

Gabriela Gutierrez-Croft, Curtis H. Blanchard, Robert B. Roemer

Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 1-6, November 15–20, 1998

Paper No: IMECE1998-0786

DOI: https://doi.org/10.1115/IMECE1998-0786

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Topics: Biological tissues, Blood vessels, Modeling, Vessels, Finite element analysis, Anatomy, Blood flow, Flow (Dynamics), Network models, Temperature

Proceedings Papers

Towards the Understanding of Blood Perfusion in Tumor Vascular Networks Using Contrast-Enhanced MRI and Invasion Percolation

Oana Craciunescu, Scott T. Clegg

Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 143-147, November 15–20, 1998

Paper No: IMECE1998-0809

DOI: https://doi.org/10.1115/IMECE1998-0809

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Topics: Blood, Magnetic resonance imaging, Percolation theory, Tumors, Fractals, Dimensions, Geometry, Patient treatment, Signals, Temperature

Proceedings Papers

A Domain Decomposition Algorithm for Thermal Analysis in X-Ray Lithography With Cylindrical Geometry

Weizhong Dai, Raja Nassar

Proc. ASME. IMECE98, Fluids Engineering, 95-100, November 15–20, 1998

Paper No: IMECE1998-0991

DOI: https://doi.org/10.1115/IMECE1998-0991

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Topics: Algorithms, Geometry, Thermal analysis, X-ray lithography, Photoresists, X-rays, Irradiation (Radiation exposure), Linear systems, Microfabrication, Numerical analysis

Proceedings Papers

Thermal Modeling and Control of Material Processing in Scan Welding

Charalabos Doumanidis, Nikolaos Fourligkas, George Korizis

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 221-228, November 15–20, 1998

Paper No: IMECE1998-1033

DOI: https://doi.org/10.1115/IMECE1998-1033

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Topics: Control modeling, Materials processing, Welding, Temperature, Arc welding, Composite materials, Computer simulation, Feedback, Heat, Joining

Proceedings Papers

Thermal Performance Analysis of Multi-Layer Thermal Energy Storage Tank Using Different Phase Change Materials

Md. Ali Azam, Mohammad Arif Hasan Mamun

Proc. ASME. IMECE2021, Volume 8B: Energy, V08BT08A050, November 1–5, 2021

Paper No: IMECE2021-72672

DOI: https://doi.org/10.1115/IMECE2021-72672

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Topics: Phase change materials, Thermal energy storage, Heat transfer, Concentrating solar power, Cycles, Energy storage, Finite element methods, Fluids, Latent heat, Numerical analysis

Proceedings Papers

Thermal Analysis of Stacked Ni-MH Battery

Katsumi Hisano, Hideo Iwasaki, Masaru Ishizuka, Tetsuya Yamane

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 333-337, November 14–19, 1999

Paper No: IMECE1999-1001

DOI: https://doi.org/10.1115/IMECE1999-1001

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Topics: Nickel metal hydride batteries, Thermal analysis, Stress, Pallets, Temperature, Batteries, Numerical analysis, Transportation systems

Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

T. M. Ying, K. C. Toh

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999

Paper No: IMECE1999-0967

DOI: https://doi.org/10.1115/IMECE1999-0967

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Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems

Proceedings Papers

Thermal Analysis of an Absolute Radiometer Designed for the Future Satellite Mission of Total Solar Irradiance Measurement

Y. J. Shen, D. H. Chen, Z. M. Zhang

Proc. ASME. IMECE99, Heat Transfer: Volume 4, 189-197, November 14–19, 1999

Paper No: IMECE1999-1119

DOI: https://doi.org/10.1115/IMECE1999-1119

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Topics: Satellites, Solar radiation, Thermal analysis, Heat, Cavities, Steady state, Temperature distribution, Transient analysis, Computer software, Control equipment

Proceedings Papers

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 163-170, November 11–16, 2001

Paper No: IMECE2001/HTD-24389

DOI: https://doi.org/10.1115/IMECE2001/HTD-24389

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Topics: Design, Optical interconnections, Vacuum, Temperature, Ceramics, Lumber, Copper, Manufacturing, Cavities, Computer software

Proceedings Papers

Thermal Analyses and Frequency Shift Design Studies for the Spallation Neutron Source Drift Tube Linac

Lucie Parietti

Proc. ASME. IMECE2001, Heat Transfer: Volume 5 — Computational, Aerospace and Environmental Heat Transfer, 153-160, November 11–16, 2001

Paper No: IMECE2001/HTD-24297

DOI: https://doi.org/10.1115/IMECE2001/HTD-24297

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Topics: Design, Neutron sources, Spallation (Nuclear physics), Thermal analysis, Cavities, Cooling, Cooling systems, Deformation, Finite element model, Heating

Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001

Paper No: IMECE2001/HTD-24382

DOI: https://doi.org/10.1115/IMECE2001/HTD-24382

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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability

Proceedings Papers

Thermal Analysis of EPAS Power Module

Ram Farhi

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 105-110, November 11–16, 2001

Paper No: IMECE2001/EPP-24712

DOI: https://doi.org/10.1115/IMECE2001/EPP-24712

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Topics: Copper, Design, Electricity (Physics), Engines, Finite element analysis, Finite element methods, Junctions, Manufacturing, Metals, Motors

Proceedings Papers

Noninvasive Measurements and Computational Modeling of SMT Assemblies

Ryszard J. Pryputniewicz, David Rosato, Cosme Furlong

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 111-115, November 11–16, 2001

Paper No: IMECE2001/EPP-24713

DOI: https://doi.org/10.1115/IMECE2001/EPP-24713

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Topics: Computer simulation, Deformation, Holography, Lasers, Manufacturing, Simulation, Surface mount technology, Temperature profiles, Thermal analysis, Thermomechanics

Proceedings Papers

Thermal Analysis of Lubricating Oil Flow Within a Wet-Disk Clutch

Tien-Chien Jen, Dan Nemecek

Proc. ASME. IMECE2000, Heat Transfer: Volume 5, 159-169, November 5–10, 2000

Paper No: IMECE2000-1571

DOI: https://doi.org/10.1115/IMECE2000-1571

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Topics: Disks, Flow (Dynamics), Lubricating oils, Thermal analysis, Temperature, Friction, Plates (structures), Accounting, Fluid dynamics, Heat transfer

2 3 4 5

NARROW

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Optimization of a Simplified Vapor Adsorption Cycle

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Transient Thermal Analysis of Outdoor Electronic Equipment

An Experimental Investigation of Steam Injection in Fractured Porous Media

Blood Vessel Network Generation for Thermal Modeling of Living Tissue

Towards the Understanding of Blood Perfusion in Tumor Vascular Networks Using Contrast-Enhanced MRI and Invasion Percolation

A Domain Decomposition Algorithm for Thermal Analysis in X-Ray Lithography With Cylindrical Geometry

Thermal Modeling and Control of Material Processing in Scan Welding

Thermal Performance Analysis of Multi-Layer Thermal Energy Storage Tank Using Different Phase Change Materials

Thermal Analysis of Stacked Ni-MH Battery

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

Thermal Analysis of an Absolute Radiometer Designed for the Future Satellite Mission of Total Solar Irradiance Measurement

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Thermal Analyses and Frequency Shift Design Studies for the Spallation Neutron Source Drift Tube Linac

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Thermal Analysis of EPAS Power Module

Noninvasive Measurements and Computational Modeling of SMT Assemblies

Thermal Analysis of Lubricating Oil Flow Within a Wet-Disk Clutch

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