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Advanced Simulation Methods for Electronics Cooling
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Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001
Paper No: IMECE2001/HTD-24382
DOI: https://doi.org/10.1115/IMECE2001/HTD-24382
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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability
Proceedings Papers

Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals

V. S. Travkin
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 101-112, November 11–16, 2001
Paper No: IMECE2001/HTD-24383
DOI: https://doi.org/10.1115/IMECE2001/HTD-24383
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Topics: Design, Heat sinks, Semiconductors (Materials), Simulation, Temperature, Flow (Dynamics), Heat exchangers, Heat flux, Heat transfer, Weight (Mass)
Proceedings Papers

Numeric Modeling of Ultrasonic Acoustic Streaming Cooling Effect on IC Chips

Q. Wan, A. V. Kuznetsov
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 113-121, November 11–16, 2001
Paper No: IMECE2001/HTD-24384
DOI: https://doi.org/10.1115/IMECE2001/HTD-24384
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Topics: Acoustics, Cooling, Modeling, Vibration, Heat, Heat flux, Wave equations
Proceedings Papers

Spreadsheet Tool for Quick-Turn 3D Numerical Modeling of Package Thermal Performance With Non-Uniform Die Heating

Abhay A. Watwe, Ravi S. Prasher
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 123-128, November 11–16, 2001
Paper No: IMECE2001/HTD-24385
DOI: https://doi.org/10.1115/IMECE2001/HTD-24385
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Topics: Computer simulation, Heating, Finite element analysis, Geometry, Heat conduction, Modeling, Steady state
Proceedings Papers

Computation of Natural Convection in Channels With Staggered Pin Fins

Dhanunjay S. Boyalakuntla, Jayathi Y. Murthy, Cristina H. Amon
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 129-137, November 11–16, 2001
Paper No: IMECE2001/HTD-24386
DOI: https://doi.org/10.1115/IMECE2001/HTD-24386
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Topics: Computation, Computer cooling, Cooling, Design, Electronics, Exterior walls, Finite volume methods, Fins, Flow (Dynamics), Heat flux
Proceedings Papers

Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

K. Ramakrishna, T.-Y. Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 139-148, November 11–16, 2001
Paper No: IMECE2001/HTD-24387
DOI: https://doi.org/10.1115/IMECE2001/HTD-24387
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Topics: Ball-Grid-Array packaging, Junctions, Mixed convection, Computation, Computational fluid dynamics, Databases, Flip-chip, Heat transfer, Thermal resistance