In this work, a low temperature method is proposed for the economical fabrication of three-dimensional (3D) ceramic substrate for Ultraviolet Light-Emitting Diodes (UV-LED) packaging. The 3D ceramic substrate using the inorganic alkali activated aluminosilicate cement paste (IAAACP) is molded by sacrificing the patterned wax mold. By controlling the viscosity, milling time, and curing temperature the of the IAAACP, the high strength 3D ceramic substrate is achieved, the corresponding shear strength reaches to 12.5MPa. After thermal shock and heat resistant test, the shear strength changed slightly, indicating the 3D ceramic substrate has excellent thermal reliability. These experimental results indicate that the prepared 3D ceramic substrate has a potential application for UV-LED packaging.

Volume Subject Area:
Heterogeneous Integration: Micro-Systems With Diverse Functionality
Topics:
Cements (Adhesives), Ceramics, Low temperature, Manufacturing, Packaging, Ultraviolet radiation, Shear strength, Hardening (Curing), Heat, Light-emitting diodes, Milling, Reliability, Temperature, Thermal shock, Viscosity
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