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Proceedings Papers

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015
Paper No: IPACK2015-48083
https://doi.org/10.1115/IPACK2015-48083
View Paper titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Durability, Testing, ASTM International, Copper, Cycles, Gallium, Performance evaluation, Surface finishing, Tin
Proceedings Papers

High Performance Thermal Conductive Sheets Made of Carbon Fibers

Keisuke Aramaki, Hiroyuki Ryoson, Yuichi Ishida
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 305-309, July 6–8, 2011
Paper No: IPACK2011-52218
https://doi.org/10.1115/IPACK2011-52218
View Paper titled, High Performance Thermal Conductive Sheets Made of Carbon Fibers
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Topics: Carbon fibers, Resins, Thermal conductivity, Compressibility, Cooling systems, Fibers, Particulate matter, Aluminum, ASTM International, Contact resistance
Proceedings Papers

The Effects of Variations in Manufacturing on PCB Thermal Properties

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 27-33, July 6–8, 2011
Paper No: IPACK2011-52113
https://doi.org/10.1115/IPACK2011-52113
View Paper titled, The Effects of Variations in Manufacturing on PCB Thermal Properties
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Topics: Manufacturing, Thermal properties, Thermal resistance, Epoxy adhesives, Epoxy resins, ASTM International, Design, Printed circuit boards, Steady state
Proceedings Papers

In-Situ, Precise and High-Speed Measurement for Novel TIM Characterization

Yuichi Ishida, Hiroyuki Ryoson, Toshiro Ota, Kazuaki Yazawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 501-506, July 19–23, 2009
Paper No: InterPACK2009-89239
https://doi.org/10.1115/InterPACK2009-89239
View Paper titled, In-Situ, Precise and High-Speed Measurement for Novel TIM Characterization
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Topics: ASTM International, Creep, Dimensions, Equilibrium (Physics), Flow (Dynamics), Heat, Pressure, Resolution (Optics), Rods, Temperature
Proceedings Papers

Joint Development of a Package-Level Thermal Interface Material Test System

Yanshu Susan Chen, Stanley Pecavar, Vadim Gektin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 615-618, July 19–23, 2009
Paper No: InterPACK2009-89398
https://doi.org/10.1115/InterPACK2009-89398
View Paper titled, Joint Development of a Package-Level Thermal Interface Material Test System
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Topics: ASTM International, Design, Gages, Heat, Junctions, Materials properties, Microelectromechanical systems, Microelectronic devices, Pressure, Stress
Proceedings Papers

Thermal Conductivity and Contact Resistance Measurements for Adhesives

Peter Teertstra
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 381-388, July 8–12, 2007
Paper No: IPACK2007-33026
https://doi.org/10.1115/IPACK2007-33026
View Paper titled, Thermal Conductivity and Contact Resistance Measurements for Adhesives
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Topics: Adhesives, Contact resistance, Thermal conductivity, Thermal properties, ASTM International, Bulk solids, Ceramics, Electronics, Fillers (Materials), Heat flux
Proceedings Papers

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

Bryan Rodgers, Ben Flood, Jeff Punch, Finbarr Waldron
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005
Paper No: IPACK2005-73352
https://doi.org/10.1115/IPACK2005-73352
View Paper titled, Determination of the Anand Viscoplasticity Model Constants for SnAgCu
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Topics: Alloys, ASTM International, Ball-Grid-Array packaging, Bone, Computer software, Constitutive equations, Displacement, Fatigue life, Finite element model, Fittings
Proceedings Papers

Effective Thermophysical Properties of Thermal Interface Materials: Part I — Definitions and Models

I. Savija, J. R. Culham, M. M. Yovanovich
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 189-200, July 6–11, 2003
Paper No: IPACK2003-35088
https://doi.org/10.1115/IPACK2003-35088
View Paper titled, Effective Thermophysical Properties of Thermal Interface Materials: Part I — Definitions and Models
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Topics: ASTM International, Solids, Stress, Thermal conductivity, Thermal resistance, Young's modulus
Proceedings Papers

Effective Thermophysical Properties of Thermal Interface Materials: Part II — Experiments and Data

I. Savija, J. R. Culham, M. M. Yovanovich
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 567-573, July 6–11, 2003
Paper No: IPACK2003-35264
https://doi.org/10.1115/IPACK2003-35264
View Paper titled, Effective Thermophysical Properties of Thermal Interface Materials: Part II — Experiments and Data
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Topics: ASTM International, Cycles, Modeling, Pressure, Temperature, Thermal conductivity, Thermal expansion, Thermal resistance, Vacuum, Young's modulus
Proceedings Papers

Dynamic Characterization of Thermal Interface Material for Electronic Cooling

Rocky Shih, Cullen E. Bash
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 159-166, July 6–11, 2003
Paper No: IPACK2003-35073
https://doi.org/10.1115/IPACK2003-35073
View Paper titled, Dynamic Characterization of Thermal Interface Material for Electronic Cooling
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Topics: ASTM International, Computer cooling, Construction, Design, Heating, Instrumentation, Product development, Testing, Thermal resistance, Vehicles