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Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Paper No: IPACK2022-96635
DOI: https://doi.org/10.1115/IPACK2022-96635
View Paper titled, Dual Converging Jets for Enhanced Liquid Impingement Cooling
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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Click here to open pdf in another window PDF for Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Paper No: IPACK2021-74116
DOI: https://doi.org/10.1115/IPACK2021-74116
View Paper titled, Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces
Click here to open pdf in another window PDF for Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces
Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Proceedings Papers

Module-Level TIM Degradation in HALT

Joshua Tompkins, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 26–28, 2021
Paper No: IPACK2021-69511
DOI: https://doi.org/10.1115/IPACK2021-69511
View Paper titled, Module-Level TIM Degradation in HALT
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Topics: Aluminum, Cooling, Cycles, Electronics, Energy dissipation, Heating, Junctions, Life testing, Maintenance, Random vibration
Proceedings Papers

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Paper No: IPACK2021-69270
DOI: https://doi.org/10.1115/IPACK2021-69270
View Paper titled, Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics
Click here to open pdf in another window PDF for Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics
Topics: Aluminum, Copper, Electronics, Sprays, Ceramics, Manufacturing, Additive manufacturing, Bonding, Deformation, Electrical properties
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Paper No: IPACK2019-6413
DOI: https://doi.org/10.1115/IPACK2019-6413
View Paper titled, Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures
Click here to open pdf in another window PDF for Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures
Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Paper No: IPACK2018-8279
DOI: https://doi.org/10.1115/IPACK2018-8279
View Paper titled, Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging
Click here to open pdf in another window PDF for Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging
Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation
Proceedings Papers

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 27–30, 2018
Paper No: IPACK2018-8358
DOI: https://doi.org/10.1115/IPACK2018-8358
View Paper titled, Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
Click here to open pdf in another window PDF for Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
Topics: Copper, Reliability, Silver, Wire, Failure mechanisms, Shear strength, High temperature, Shear (Mechanics), Wire bonding, Aluminum
Proceedings Papers

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

Shenghui Lei, Alexandre Shen, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 29–September 1, 2017
Paper No: IPACK2017-74181
DOI: https://doi.org/10.1115/IPACK2017-74181
View Paper titled, Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates
Click here to open pdf in another window PDF for Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates
Topics: Photonics, Silicon, Thermal resistance, Etching, Silicon-on-insulator, Cladding systems (Building), Thermal conductivity, Aluminum, Crystals, Diffusion (Physics)
Proceedings Papers

Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices

Shenghui Lei, Ertugrul Kardemir, David McCloskey, John F. Donegan, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 29–September 1, 2017
Paper No: IPACK2017-74184
DOI: https://doi.org/10.1115/IPACK2017-74184
View Paper titled, Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices
Click here to open pdf in another window PDF for Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices
Topics: Flat heat pipes, Photonic equipment, Thermomechanics, Thin films, Stress, Waveguides, Cladding systems (Building), Design, Failure, Polymers
Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Paper No: IPACK2017-74286
DOI: https://doi.org/10.1115/IPACK2017-74286
View Paper titled, Advancements in Silver Wire Bonding
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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry
Proceedings Papers

Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature

Pradeep Lall, Yihua Luo, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 29–September 1, 2017
Paper No: IPACK2017-74325
DOI: https://doi.org/10.1115/IPACK2017-74325
View Paper titled, Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
Click here to open pdf in another window PDF for Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
Topics: Aluminum, Copper, Electronics, High temperature, Ionic mobility, Wire, Corrosion, Diffusion (Physics), Gates (Closures), Bonding
Proceedings Papers

Users’ Thermal Response to a Simulated Tablet Computer Surface

Han Zhang, Alan Hedge, Beiyuan Guo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015
Paper No: IPACK2015-48787
DOI: https://doi.org/10.1115/IPACK2015-48787
View Paper titled, Users’ Thermal Response to a Simulated Tablet Computer Surface
Click here to open pdf in another window PDF for Users’ Thermal Response to a Simulated Tablet Computer Surface
Topics: Computers, Temperature, Engineering prototypes, Heat, Heating, Aluminum, Design, Sensors, Skin
Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015
Paper No: IPACK2015-48027
DOI: https://doi.org/10.1115/IPACK2015-48027
View Paper titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
Click here to open pdf in another window PDF for Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling
Proceedings Papers

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001, July 6–9, 2015
Paper No: IPACK2015-48088
DOI: https://doi.org/10.1115/IPACK2015-48088
View Paper titled, Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels
Click here to open pdf in another window PDF for Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels
Topics: Design, Heat sinks, Silicon, Aluminum, Copper, Energy dissipation, Heat, Modeling, Slug flows, Cooling
Proceedings Papers

Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A011, July 6–9, 2015
Paper No: IPACK2015-48417
DOI: https://doi.org/10.1115/IPACK2015-48417
View Paper titled, Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation
Click here to open pdf in another window PDF for Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation
Topics: Density, Heat exchangers, Flow (Dynamics), Heat, Temperature, Heat sinks, Heat transfer, Hydrofoil, Junctions, Water
Proceedings Papers

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A004, July 6–9, 2015
Paper No: IPACK2015-48638
DOI: https://doi.org/10.1115/IPACK2015-48638
View Paper titled, Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
Click here to open pdf in another window PDF for Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
Topics: Aluminum, Copper, Wire, Temperature, Chemistry, Compression, Failure analysis, Image processing, Metals, Molding
Proceedings Papers

Effect of Temperature Cycling and High Temperature Aging on the Elastic Properties and Failure Modes of Thermal Interface Materials

Taryn J. Davis, Tuhin Sinha, Ken Marston, Sushumna Iruvanti
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A014, July 6–9, 2015
Paper No: IPACK2015-48712
DOI: https://doi.org/10.1115/IPACK2015-48712
View Paper titled, Effect of Temperature Cycling and High Temperature Aging on the Elastic Properties and Failure Modes of Thermal Interface Materials
Click here to open pdf in another window PDF for Effect of Temperature Cycling and High Temperature Aging on the Elastic Properties and Failure Modes of Thermal Interface Materials
Topics: Adhesion, Aluminum, Elasticity, Failure mechanisms, Finite element analysis, Finite element methods, Finite element model, Flip-chip, High temperature, Mechanical testing
Proceedings Papers

Analysis of Intermetallic Formation During Ultrasonic Ball Bonding

Panthea Sepehrband, Maryam Gholamirad
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A028, July 6–9, 2015
Paper No: IPACK2015-48812
DOI: https://doi.org/10.1115/IPACK2015-48812
View Paper titled, Analysis of Intermetallic Formation During Ultrasonic Ball Bonding
Click here to open pdf in another window PDF for Analysis of Intermetallic Formation During Ultrasonic Ball Bonding
Topics: Bonding, Intermetallic compounds, Alloys, Aluminum, Copper, Diffusion (Physics), Experimental analysis, Finite element analysis, Low temperature, Micromechanical devices
Proceedings Papers

Pre-Applied Inter Chip Fill for 3D-IC Chip Joining

Yasuhiro Kawase, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A015, July 6–9, 2015
Paper No: IPACK2015-48738
DOI: https://doi.org/10.1115/IPACK2015-48738
View Paper titled, Pre-Applied Inter Chip Fill for 3D-IC Chip Joining
Click here to open pdf in another window PDF for Pre-Applied Inter Chip Fill for 3D-IC Chip Joining
Topics: Joining, Pellet fusion, Thermal conductivity, Fillers (Materials), Aluminum, Boron, Composite materials, Cooling, Density, Epoxy adhesives