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Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
DOI: https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application

Ming-Han Zhuang, Teny Shih, David Lai, Yu-Po Wang
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 26–28, 2021
Paper No: IPACK2021-66660
DOI: https://doi.org/10.1115/IPACK2021-66660
View Paper titled, Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application
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Topics: Ball-Grid-Array packaging, Cloud computing, Internet, Signals
Proceedings Papers

Design and Application of Innovative 3DVC in AI Server System

Xianguang Tan, Yongzhan He, Bin Liu, Jiang Yu, Ahuja Nishi, Wenbin Tian
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 26–28, 2021
Paper No: IPACK2021-69723
DOI: https://doi.org/10.1115/IPACK2021-69723
View Paper titled, Design and Application of Innovative 3DVC in AI Server System
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Topics: Cooling, Design, Graphics processing units, Energy consumption, Artificial intelligence, Cloud computing, Energy dissipation, Heat, Heat pipes, Heat sinks
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Paper No: IPACK2018-8305
DOI: https://doi.org/10.1115/IPACK2018-8305
View Paper titled, Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling
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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing
Proceedings Papers

Rack Server Solution in Data Center

Sheng Kang, Guofeng Chen, Chun Wang, Ruiquan Ding, Jiajun Zhang, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A042, July 6–9, 2015
Paper No: IPACK2015-48258
DOI: https://doi.org/10.1115/IPACK2015-48258
View Paper titled, Rack Server Solution in Data Center
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Topics: Data centers, Cooling, Energy consumption, Design, Fans, Air flow, Energy efficiency, Server racks, Cloud computing, Heat
Proceedings Papers

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Yongzhan He, Guofeng Chen, Jiajun Zhang, Tianyu Zhou, Tao Liu, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A014, July 6–9, 2015
Paper No: IPACK2015-48169
DOI: https://doi.org/10.1115/IPACK2015-48169
View Paper titled, Consideration for Running Data Center at High Temperatures and Using Free Air Cooling
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Topics: Cooling, Data centers, High temperature, Corrosion, Internet, Temperature, Design, Operating temperature, Refrigeration, Carbon dioxide
Proceedings Papers

Cooling Energy Reduction During Dynamically Controlled Data Center Operation

Pritish R. Parida, Timothy J. Chainer, Mark D. Schultz, Milnes P. David
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A017, July 16–18, 2013
Paper No: IPACK2013-73208
DOI: https://doi.org/10.1115/IPACK2013-73208
View Paper titled, Cooling Energy Reduction During Dynamically Controlled Data Center Operation
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Topics: Cooling, Data centers, Energy consumption, Temperature, Algorithms, Heat, Air conditioning, Cloud computing, Density, Dynamic systems
Proceedings Papers

Operational Benefits of Real-Time Monitoring and Visualization in Data Centers

Tahir Cader, Ratnesh Sharma, Cullen Bash, Les Fox, Vaibhav Bhatia, Mohandas Mekanapurath
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1033-1046, July 19–23, 2009
Paper No: InterPACK2009-89379
DOI: https://doi.org/10.1115/InterPACK2009-89379
View Paper titled, Operational Benefits of Real-Time Monitoring and Visualization in Data Centers
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Topics: Data centers, Visualization, Computers, Energy consumption, Environmental Protection Agency, Sensors, Air flow, Cloud computing, Computer software, Cooling systems