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Proceedings Papers

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A005, October 25–27, 2022
Paper No: IPACK2022-97412
DOI: https://doi.org/10.1115/IPACK2022-97412
View Paper titled, Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics
Click here to open pdf in another window PDF for Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics
Topics: Chemical vapor deposition, Coatings, Cooling, Density, Electrodes, Electronics, Fluids, Ionization, Thermal resistance
Proceedings Papers

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 26–28, 2021
Paper No: IPACK2021-73313
DOI: https://doi.org/10.1115/IPACK2021-73313
View Paper titled, Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
Click here to open pdf in another window PDF for Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
Topics: Coatings, Coolants, Cooling, Design, Durability, Electric fields, Electronics, Flow (Dynamics), Fluids, Heat
Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Paper No: IPACK2020-2613
DOI: https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
Click here to open pdf in another window PDF for Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Paper No: IPACK2020-2591
DOI: https://doi.org/10.1115/IPACK2020-2591
View Paper titled, Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
Click here to open pdf in another window PDF for Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

Quang N. Pham, Youngjoon Suh, Bowen Shao, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019
Paper No: IPACK2019-6307
DOI: https://doi.org/10.1115/IPACK2019-6307
View Paper titled, Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings
Click here to open pdf in another window PDF for Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings
Topics: Boiling, Bubbles, Coatings, Dynamics (Mechanics), Heat transfer, Pool boiling, Flow (Dynamics), Thermal management, Cooling, Design
Proceedings Papers

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 7–9, 2019
Paper No: IPACK2019-6541
DOI: https://doi.org/10.1115/IPACK2019-6541
View Paper titled, Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design
Click here to open pdf in another window PDF for Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design
Topics: Design, Finite element analysis, Lamination, Light-emitting diodes, Simulation, Stress, Adhesives, Coatings, Fatigue, Materials properties
Proceedings Papers

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018
Paper No: IPACK2018-8211
DOI: https://doi.org/10.1115/IPACK2018-8211
View Paper titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging
Click here to open pdf in another window PDF for Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging
Topics: Light-emitting diodes, Packaging, Silicones, Wetting, Coating processes, Coatings, Phosphors, Domes (Structural elements), Geometry, Particulate matter
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Paper No: IPACK2018-8338
DOI: https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
Click here to open pdf in another window PDF for Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Silica Nanoparticle Formation by Using Droplet-Based Microreactor

Arsalan Nikdoost, Alican Ozkan, Yusuf Kelestemur, Hilmi Volkan Demir, E. Yegan Erdem
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 29–September 1, 2017
Paper No: IPACK2017-74178
DOI: https://doi.org/10.1115/IPACK2017-74178
View Paper titled, Silica Nanoparticle Formation by Using Droplet-Based Microreactor
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Topics: Drops, Nanoparticles, Coating processes, Coatings, Microfluidics, Particulate matter, Quantum dots
Proceedings Papers

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, August 29–September 1, 2017
Paper No: IPACK2017-74195
DOI: https://doi.org/10.1115/IPACK2017-74195
View Paper titled, Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer
Click here to open pdf in another window PDF for Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer
Topics: Light-emitting diodes, Phosphors, Shapes, Geometry, Coating processes, Coatings, Computer simulation, Fluids, Temperature
Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Paper No: IPACK2017-74286
DOI: https://doi.org/10.1115/IPACK2017-74286
View Paper titled, Advancements in Silver Wire Bonding
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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry
Proceedings Papers

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 29–September 1, 2017
Paper No: IPACK2017-74322
DOI: https://doi.org/10.1115/IPACK2017-74322
View Paper titled, Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures
Click here to open pdf in another window PDF for Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures
Topics: Bending (Stress), Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, Temperature, Fracture (Materials), Elongation, Shock (Mechanics), Failure
Proceedings Papers

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

Suchismita Sarangi, Will A. Kuhn, Scott Rider, Claude Wright, Shankar Krishnan
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A046, July 6–9, 2015
Paper No: IPACK2015-48640
DOI: https://doi.org/10.1115/IPACK2015-48640
View Paper titled, Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters
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Topics: Cooling, Fluids, Temperature, Boiling, Bose-Einstein condensates, Air flow, Coating processes, Coatings, Coolants, Engineering standards
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Paper No: IPACK2015-48814
DOI: https://doi.org/10.1115/IPACK2015-48814
View Paper titled, Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
Click here to open pdf in another window PDF for Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

Reliability of Interconnections Made of Sintered Silver Nano Particles

Przemyslaw K. Matkowski, Tomasz Falat, Andrzej Moscicki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A016, July 6–9, 2015
Paper No: IPACK2015-48795
DOI: https://doi.org/10.1115/IPACK2015-48795
View Paper titled, Reliability of Interconnections Made of Sintered Silver Nano Particles
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Topics: Nanoparticles, Reliability, Silver, Sensors, Algorithms, Chain, Coating processes, Coatings, Computerized tomography, Failure mechanisms
Proceedings Papers

Arcing and Spacing Requirements for High Voltage Printed Circuit Boards

Prabjit Singh
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A011, July 6–9, 2015
Paper No: IPACK2015-48180
DOI: https://doi.org/10.1115/IPACK2015-48180
View Paper titled, Arcing and Spacing Requirements for High Voltage Printed Circuit Boards
Click here to open pdf in another window PDF for Arcing and Spacing Requirements for High Voltage Printed Circuit Boards
Topics: Cellulosic fibers, Circuits, Coating processes, Coatings, Dust, Electric potential, Gates (Closures), Hardware, MOSFET transistors, Physics
Proceedings Papers

Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit

Yusuke Watanabe, Yuji Ichikawa, Kazuhiro Ogawa, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A007, July 16–18, 2013
Paper No: IPACK2013-73150
DOI: https://doi.org/10.1115/IPACK2013-73150
View Paper titled, Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit
Click here to open pdf in another window PDF for Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit
Topics: Copper, Mechanical properties, Particulate matter, Brittle fracture, Ceramics, Coating processes, Coatings, Dielectric materials, Electrical properties, Electron backscatter diffraction
Proceedings Papers

Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A004, July 16–18, 2013
Paper No: IPACK2013-73113
DOI: https://doi.org/10.1115/IPACK2013-73113
View Paper titled, Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon
Click here to open pdf in another window PDF for Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon
Topics: Coating processes, Coatings, Sapphire, Silicon, Delamination, Bonding, Resins, Stress, Cooling, Temperature
Proceedings Papers

A Theoretical Model for a Flat Micro Heat Pipe With a Grooved Wick Using Nanofluids

Kyu Hyung Do, Byung Il Choi, Yong Shik Han, Seok Pil Jang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 83-90, July 19–23, 2009
Paper No: InterPACK2009-89138
DOI: https://doi.org/10.1115/InterPACK2009-89138
View Paper titled, A Theoretical Model for a Flat Micro Heat Pipe With a Grooved Wick Using Nanofluids
Click here to open pdf in another window PDF for A Theoretical Model for a Flat Micro Heat Pipe With a Grooved Wick Using Nanofluids
Topics: Heat pipes, Nanofluids, Coating processes, Coatings, Condensation, Evaporation, Fluids, Heat conduction, Heat transfer, Nanoparticles
Proceedings Papers

Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages

Karl J. L. Geisler
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 915-920, July 19–23, 2009
Paper No: InterPACK2009-89312
DOI: https://doi.org/10.1115/InterPACK2009-89312
View Paper titled, Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages
Click here to open pdf in another window PDF for Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages
Topics: Coatings, Fatigue, Solders, Fatigue life, Failure, Failure data, Shapes, Solder joints, Temperature, Urethane elastomers