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Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Paper No: IPACK2021-73015
https://doi.org/10.1115/IPACK2021-73015
View Paper titled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Paper No: IPACK2019-6389
https://doi.org/10.1115/IPACK2019-6389
View Paper titled, Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Proceedings Papers

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Richard C. Ordonez, Noah Acosta, Jordan Melcher, Nackieb Kamin, David Garmire
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A011, July 6–9, 2015
Paper No: IPACK2015-48567
https://doi.org/10.1115/IPACK2015-48567
View Paper titled, Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices
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Topics: Graphene, Liquid metals, Ohmic contacts, Photonic equipment, Contact resistance, Carbon, Engineering standards, Overlays (Materials engineering), Oxidation, Pressure
Proceedings Papers

Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Thomas L. Bougher, John H. Taphouse, Baratunde A. Cola
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A005, July 6–9, 2015
Paper No: IPACK2015-48587
https://doi.org/10.1115/IPACK2015-48587
View Paper titled, Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance
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Topics: Carbon nanotubes, Thermoreflectance, Contact resistance, Heat transfer, Heating, Mechanical properties, Metrology, Probes, Thermal conductivity, Uncertainty
Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Rick Beyerle, Gary Shives
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Paper No: IPACK2015-48523
https://doi.org/10.1115/IPACK2015-48523
View Paper titled, Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications
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Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics
Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Paper No: IPACK2015-48302
https://doi.org/10.1115/IPACK2015-48302
View Paper titled, On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)
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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites
Proceedings Papers

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A075, July 6–9, 2015
Paper No: IPACK2015-48535
https://doi.org/10.1115/IPACK2015-48535
View Paper titled, Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications
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Topics: Contact resistance, Metal foams, Porosity, Fillers (Materials), Foams (Chemistry), Aluminum, Elastic moduli, Elasticity, Phase change materials, Simulation
Proceedings Papers

Thermal Spreading Resistance in a Multilayered Orthotropic Circular Disk With Interfacial Resistance and Variable Heat Flux

Y. S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A053, July 6–9, 2015
Paper No: IPACK2015-48243
https://doi.org/10.1115/IPACK2015-48243
View Paper titled, Thermal Spreading Resistance in a Multilayered Orthotropic Circular Disk With Interfacial Resistance and Variable Heat Flux
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Topics: Disks, Heat flux, Interfacial thermal resistance, Electrical conductance, Boundary-value problems, Computer software, Contact resistance, FORTRAN, Modeling, Thermal resistance
Proceedings Papers

Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs

Timothy J. Longson, James Maddocks, Ali Kashani
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A078, July 6–9, 2015
Paper No: IPACK2015-48735
https://doi.org/10.1115/IPACK2015-48735
View Paper titled, Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs
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Topics: Multi-walled nanotubes, Contact resistance, Temperature, Heat conduction, Modeling, Carbon, Catalysts, Deformation, Density, Multi-walled carbon nanotubes
Proceedings Papers

Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

Bahar Öner, Hakan Ertürk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A055, July 6–9, 2015
Paper No: IPACK2015-48333
https://doi.org/10.1115/IPACK2015-48333
View Paper titled, Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages
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Topics: Electronic packages, Nondestructive evaluation, Thermal diffusion, Heat, Acoustics, Algorithms, Contact resistance, Density, Energy dissipation, Flat heat pipes
Proceedings Papers

Basic Study on Transient Temperature Response of Papers in a Thermal Transfer Printer

Koichi Hirose, Takashi Fukue, Fumiya Nakagawa, Risa Ito, Tomoko Wauke, Hisashi Hoshino, Hirotoshi Terao
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A019, July 16–18, 2013
Paper No: IPACK2013-73088
https://doi.org/10.1115/IPACK2013-73088
View Paper titled, Basic Study on Transient Temperature Response of Papers in a Thermal Transfer Printer
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Topics: Temperature, Transients (Dynamics), Printing, Contact resistance, Heat, Heating, Network analysis, Thermal papers
Proceedings Papers

High Performance Thermal Conductive Sheets Made of Carbon Fibers

Keisuke Aramaki, Hiroyuki Ryoson, Yuichi Ishida
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 305-309, July 6–8, 2011
Paper No: IPACK2011-52218
https://doi.org/10.1115/IPACK2011-52218
View Paper titled, High Performance Thermal Conductive Sheets Made of Carbon Fibers
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Topics: Carbon fibers, Resins, Thermal conductivity, Compressibility, Cooling systems, Fibers, Particulate matter, Aluminum, ASTM International, Contact resistance
Proceedings Papers

Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar, R. Mahajan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 773-780, July 6–8, 2011
Paper No: IPACK2011-52221
https://doi.org/10.1115/IPACK2011-52221
View Paper titled, Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials
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Topics: Composite materials, Solders, Sintering, Yield strength, Melting, Contact resistance, Diffusion (Physics), Electrical properties, Intermetallic compounds, Shear (Mechanics)
Proceedings Papers

Effect of Thermal Contact Resistance on Optimum Mini-Contact TEC Cooling of On-Chip Hot Spots

Viatcheslav Litvinovitch, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 147-158, July 19–23, 2009
Paper No: InterPACK2009-89289
https://doi.org/10.1115/InterPACK2009-89289
View Paper titled, Effect of Thermal Contact Resistance on Optimum Mini-Contact TEC Cooling of On-Chip Hot Spots
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Topics: Contact resistance, Cooling, Thermal management, Thermoelectric coolers
Proceedings Papers

Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay

Adam G. Pautsch, Arun Gowda, Ljubisa Stevanovic, Rich Beaupre
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 427-436, July 19–23, 2009
Paper No: InterPACK2009-89190
https://doi.org/10.1115/InterPACK2009-89190
View Paper titled, Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay
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Topics: Cooling, Electronics, Microchannels, Overlays (Materials engineering), Heat exchangers, Heat sinks, Contact resistance, Design, Heat transfer, Silicon
Proceedings Papers

Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response

Jung-Kyun Kim, Wataru Nakayama, Sun-Kyu Lee
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 103-111, July 19–23, 2009
Paper No: InterPACK2009-89033
https://doi.org/10.1115/InterPACK2009-89033
View Paper titled, Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response
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Topics: Contact resistance, Electronic packages, Heat, Modeling, System dynamics, Temperature, Transients (Dynamics)
Proceedings Papers

Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

Feng Gao, Jianmin Qu, Matthew Yao
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 543-547, July 19–23, 2009
Paper No: InterPACK2009-89099
https://doi.org/10.1115/InterPACK2009-89099
View Paper titled, Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad
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Topics: Carbon nanotubes, Contact resistance, Copper, Electron configuration, Density, Electrodes, Electrons, Density functional theory, Electrical properties, Electronics
Proceedings Papers

Thermal Conductivity and Contact Resistance Measurements for Adhesives

Peter Teertstra
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 381-388, July 8–12, 2007
Paper No: IPACK2007-33026
https://doi.org/10.1115/IPACK2007-33026
View Paper titled, Thermal Conductivity and Contact Resistance Measurements for Adhesives
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Topics: Adhesives, Contact resistance, Thermal conductivity, Thermal properties, ASTM International, Bulk solids, Ceramics, Electronics, Fillers (Materials), Heat flux
Proceedings Papers

Failure Analysis of Contact Probe Pins for SnPb and Sn Applications

Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 31-36, July 8–12, 2007
Paper No: IPACK2007-33214
https://doi.org/10.1115/IPACK2007-33214
View Paper titled, Failure Analysis of Contact Probe Pins for SnPb and Sn Applications
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Topics: Failure analysis, Pins (Engineering), Probes, Tin, Failure, Inspection, Wear, Contact resistance, Failure mechanisms, Surface roughness
Proceedings Papers

Phase Change Metallic Alloy TIM2 Performance and Reliability

Chris G. Macris, Robert G. Ebel, Christopher B. Leyerle, John C. McCullough
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 415-422, July 8–12, 2007
Paper No: IPACK2007-33702
https://doi.org/10.1115/IPACK2007-33702
View Paper titled, Phase Change Metallic Alloy TIM2 Performance and Reliability
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Topics: Alloys, Reliability, Vehicles, Accelerated life testing, Contact resistance, Electrical measurement, Junctions, Metals, Performance characterization, Stress