1-20 of 96
Deformation
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Paper No: IPACK2022-97349
https://doi.org/10.1115/IPACK2022-97349
View Paper titled, Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
Open the PDF for Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods in another window
Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Reliability, Thermomechanics, Cycles, Solders, Corners (Structural elements), Bonding, Deformation, Stiffness
Proceedings Papers

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Paper No: IPACK2022-97218
https://doi.org/10.1115/IPACK2022-97218
View Paper titled, Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process
Open the PDF for Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process in another window
Topics: Bonding, Computation, Computer simulation, Deformation, Design, Engineering prototypes, Flow (Dynamics), Levitation, Optimization, Physics
Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021
Paper No: IPACK2021-73100
https://doi.org/10.1115/IPACK2021-73100
View Paper titled, Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading
Open the PDF for Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading in another window
Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders
Proceedings Papers

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Paper No: IPACK2021-69270
https://doi.org/10.1115/IPACK2021-69270
View Paper titled, Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics
Open the PDF for Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics in another window
Topics: Aluminum, Copper, Electronics, Sprays, Ceramics, Manufacturing, Additive manufacturing, Bonding, Deformation, Electrical properties
Proceedings Papers

Deformation Behavior of SAC305 Solder Joints With Multiple Grains

Debabrata Mondal, Abdullah Fahim, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 27–29, 2020
Paper No: IPACK2020-2694
https://doi.org/10.1115/IPACK2020-2694
View Paper titled, Deformation Behavior of SAC305 Solder Joints With Multiple Grains
Open the PDF for Deformation Behavior of SAC305 Solder Joints With Multiple Grains in another window
Topics: Anisotropy, Deformation, Grain size, Solder joints
Proceedings Papers

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020
Paper No: IPACK2020-2614
https://doi.org/10.1115/IPACK2020-2614
View Paper titled, PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
Open the PDF for PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications in another window
Topics: Printed circuit boards, Thermomechanics, Stress, Ceramics, Control panels, Deformation, Electronic components, Experimental methods, Finite element analysis, Reliability
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
Open the PDF for High Performance Computing Package With Chip Module on Substrate Solutions in another window
Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Paper No: IPACK2019-6561
https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
Open the PDF for Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties in another window
Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Gary Liang, Ashkan Sadeghifard, Anirudh Krishna, Jaeho Lee, Edwin A. Peraza Hernandez
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 7–9, 2019
Paper No: IPACK2019-6402
https://doi.org/10.1115/IPACK2019-6402
View Paper titled, Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management
Open the PDF for Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management in another window
Topics: Alloys, Modeling, Shapes, Thermal management, Springs, Temperature, Solar energy, Deformation, Irradiation (Radiation exposure), Actuators
Proceedings Papers

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

Yuvraj Singh, Anirudh Udupa, Srinivasan Chandrasekar, Ganesh Subbarayan
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 7–9, 2019
Paper No: IPACK2019-6510
https://doi.org/10.1115/IPACK2019-6510
View Paper titled, Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments
Open the PDF for Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments in another window
Topics: Alloys, Lead-free solders, Metal cutting, Cutting, Testing, Cutting tools, Deformation, Dynamometers, Hammers, Microscale devices
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
Open the PDF for Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design in another window
Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Paper No: IPACK2018-8408
https://doi.org/10.1115/IPACK2018-8408
View Paper titled, Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging
Open the PDF for Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging in another window
Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Paper No: IPACK2018-8410
https://doi.org/10.1115/IPACK2018-8410
View Paper titled, The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders
Open the PDF for The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders in another window
Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Paper No: IPACK2018-8257
https://doi.org/10.1115/IPACK2018-8257
View Paper titled, Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
Open the PDF for Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP in another window
Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Paper No: IPACK2018-8279
https://doi.org/10.1115/IPACK2018-8279
View Paper titled, Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging
Open the PDF for Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging in another window
Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Paper No: IPACK2017-74169
https://doi.org/10.1115/IPACK2017-74169
View Paper titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Open the PDF for Lead-Free Alternatives for Interconnects in High-Temperature Electronics in another window
Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Paper No: IPACK2017-74158
https://doi.org/10.1115/IPACK2017-74158
View Paper titled, Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling
Open the PDF for Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling in another window
Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics
Proceedings Papers

Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components

Min Pei, Guru Arakere, Milena Vujosevic
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, August 29–September 1, 2017
Paper No: IPACK2017-74082
https://doi.org/10.1115/IPACK2017-74082
View Paper titled, Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components
Open the PDF for Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components in another window
Topics: Ball-Grid-Array packaging, Shock (Mechanics), Failure, Physics, Computer simulation, Deformation, Design, Stress
Proceedings Papers

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation

Pradeep Lall, Nakul Kothari, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, August 29–September 1, 2017
Paper No: IPACK2017-74269
https://doi.org/10.1115/IPACK2017-74269
View Paper titled, Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation
Open the PDF for Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation in another window
Topics: Damage, Shock (Mechanics), X-rays, Reliability, Deformation, Failure, Imaging, Manufacturing, Nondestructive evaluation, Service life (Equipment)
Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017
Paper No: IPACK2017-74010
https://doi.org/10.1115/IPACK2017-74010
View Paper titled, Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
Open the PDF for Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer in another window
Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)