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Proceedings Papers

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022
Paper No: IPACK2022-92306
DOI: https://doi.org/10.1115/IPACK2022-92306
View Paper titled, Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods
Click here to open pdf in another window PDF for Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods
Topics: Aerosols, Drops, Electronics, Silver, Temperature, Testing, Water
Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Paper No: IPACK2022-97428
DOI: https://doi.org/10.1115/IPACK2022-97428
View Paper titled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
Click here to open pdf in another window PDF for Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Paper No: IPACK2020-2613
DOI: https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Paper No: IPACK2018-8311
DOI: https://doi.org/10.1115/IPACK2018-8311
View Paper titled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields
Proceedings Papers

Silica Nanoparticle Formation by Using Droplet-Based Microreactor

Arsalan Nikdoost, Alican Ozkan, Yusuf Kelestemur, Hilmi Volkan Demir, E. Yegan Erdem
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 29–September 1, 2017
Paper No: IPACK2017-74178
DOI: https://doi.org/10.1115/IPACK2017-74178
View Paper titled, Silica Nanoparticle Formation by Using Droplet-Based Microreactor
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Topics: Drops, Nanoparticles, Coating processes, Coatings, Microfluidics, Particulate matter, Quantum dots
Proceedings Papers

Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces

Russell J. LaBrie, II, Jorge Padilla, Jr., Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A003, July 6–9, 2015
Paper No: IPACK2015-48153
DOI: https://doi.org/10.1115/IPACK2015-48153
View Paper titled, Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces
Click here to open pdf in another window PDF for Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces
Topics: Drops, Heat transfer, Water, Nanocrystals, Heat transfer coefficients, Copper, Evaporation, Film thickness, Gravity (Force), Hydrophilicity
Proceedings Papers

Influence of Reynolds Number of Tube Flow on Coalescence of Droplets in a Tube Creeping Flow

Masahiro Muraoka, Yuuki Kumagai, Yuuta Yatagawa, Ichiro Ueno
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A016, July 6–9, 2015
Paper No: IPACK2015-48241
DOI: https://doi.org/10.1115/IPACK2015-48241
View Paper titled, Influence of Reynolds Number of Tube Flow on Coalescence of Droplets in a Tube Creeping Flow
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Topics: Creeping flow, Drops, Flow (Dynamics), Reynolds number, Clearances (Engineering)
Proceedings Papers

Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer

Kazuhisa Yuki, Katsuki Fukushima, Koichi Suzuki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A005, July 6–9, 2015
Paper No: IPACK2015-48628
DOI: https://doi.org/10.1115/IPACK2015-48628
View Paper titled, Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer
Click here to open pdf in another window PDF for Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer
Topics: Boiling, Drops, Evaporation, Particulate matter, Nanoparticles, Adhesion, Temperature, Bubbles, Critical heat flux, Heat transfer
Proceedings Papers

Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness

Susmita Dash, Niru Kumari, Mercy Dicuangco, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 685-692, July 6–8, 2011
Paper No: IPACK2011-52046
DOI: https://doi.org/10.1115/IPACK2011-52046
View Paper titled, Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness
Click here to open pdf in another window PDF for Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness
Topics: Manufacturing, Surface roughness, Drops, Microscale devices, Dynamics (Mechanics), Etching, Robustness, Wetting
Proceedings Papers

Dynamics of Droplet Motion Under Electrowetting Actuation

S. Ravi Annapragada, Susmita Dash, Suresh V. Garimella, Jayathi Y. Murthy
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 693-701, July 6–8, 2011
Paper No: IPACK2011-52061
DOI: https://doi.org/10.1115/IPACK2011-52061
View Paper titled, Dynamics of Droplet Motion Under Electrowetting Actuation
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Topics: Drops, Dynamics (Mechanics), Shapes, Transients (Dynamics), Fluids, Physics, Steady state, Surface tension, Water
Proceedings Papers

Experiments and Modeling of a Liquid Droplet Transported by a Gas Stream Impinging on a Heated Surface: Single Phase Regime

Ryan P. Anderson, Alfonso Ortega
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 229-237, July 19–23, 2009
Paper No: InterPACK2009-89020
DOI: https://doi.org/10.1115/InterPACK2009-89020
View Paper titled, Experiments and Modeling of a Liquid Droplet Transported by a Gas Stream Impinging on a Heated Surface: Single Phase Regime
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Topics: Drops, Modeling, Heat transfer coefficients, Sprays, Air flow, Convection, Cooling, Dynamics (Mechanics), Evaporation, Flow (Dynamics)
Proceedings Papers

Mixing Behaviour of Coalescing Droplets in a Tube

Masahiro Muraoka, Naoki Ogawa, Renpei Fujita, Ichiro Ueno, Hiroshi Mizoguchi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 357-361, July 19–23, 2009
Paper No: InterPACK2009-89121
DOI: https://doi.org/10.1115/InterPACK2009-89121
View Paper titled, Mixing Behaviour of Coalescing Droplets in a Tube
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Topics: Drops, Particulate matter, Flow (Dynamics), Fluids, Geometry
Proceedings Papers

Numerical Analysis of Mist-Cooled High Power Components in Cabinets

Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Paper No: InterPACK2009-89269
DOI: https://doi.org/10.1115/InterPACK2009-89269
View Paper titled, Numerical Analysis of Mist-Cooled High Power Components in Cabinets
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Topics: Numerical analysis, Flow (Dynamics), Heat sinks, Drops, Evaporation, Telecommunications, Thermal management, Acoustics, Circuits, Cooling
Proceedings Papers

Wetting Hysteresis, Metastability, and Droplet Impact on Superhydrophobic Surfaces

Kripa K. Varanasi, Tao Deng, Ming F. Hsu, Nitin Bhate
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 623-630, July 19–23, 2009
Paper No: InterPACK2009-89350
DOI: https://doi.org/10.1115/InterPACK2009-89350
View Paper titled, Wetting Hysteresis, Metastability, and Droplet Impact on Superhydrophobic Surfaces
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Topics: Drops, Wetting, Pressure, Equilibrium (Physics), Energetics, Surface energy, Surface texture, Water, Water hammer
Proceedings Papers

An Experimental Study of Onset Condition for Electrohydrodynamic Jetting

Hyojun Kim, Junyoung Song, Jaeik Jeong, Jaewon Chung
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 183-186, July 19–23, 2009
Paper No: InterPACK2009-89387
DOI: https://doi.org/10.1115/InterPACK2009-89387
View Paper titled, An Experimental Study of Onset Condition for Electrohydrodynamic Jetting
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Topics: Electrohydrodynamics, Nozzles, Pressure, Printing, Reservoirs, Drops, Electric fields, Electrodes, Flow (Dynamics), Fluids
Proceedings Papers

Effect of Orientation and Draining on Linear Spray Array Thermal Management

Benjamin M. Regner, Timothy A. Shedd
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 375-380, July 8–12, 2007
Paper No: IPACK2007-33833
DOI: https://doi.org/10.1115/IPACK2007-33833
View Paper titled, Effect of Orientation and Draining on Linear Spray Array Thermal Management
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Topics: Drainage, Sprays, Thermal management, Cooling, Critical heat flux, Drops, Fluids, Geometry, Heart failure, Heat flux
Proceedings Papers

A Fundamental Approach to Modeling Transport to an Impinging Spray

Andrea C. Ashwood, Curtis Lane, Benjamin M. Regner, Timothy A. Shedd
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 267-272, July 8–12, 2007
Paper No: IPACK2007-33898
DOI: https://doi.org/10.1115/IPACK2007-33898
View Paper titled, A Fundamental Approach to Modeling Transport to an Impinging Spray
Click here to open pdf in another window PDF for A Fundamental Approach to Modeling Transport to an Impinging Spray
Topics: Modeling, Sprays, Liquid films, Computer simulation, Fittings, Simulation, Computational fluid dynamics, Drops, Fluids, Jets
Proceedings Papers

Effects of Acoustic Resonance on Hydrodynamics and Evaporation of a Pendant Liquid Droplet

Jong Hoon Moon, Byung Ha Kang, Ho-Young Kim
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2005-2009, July 17–22, 2005
Paper No: IPACK2005-73111
DOI: https://doi.org/10.1115/IPACK2005-73111
View Paper titled, Effects of Acoustic Resonance on Hydrodynamics and Evaporation of a Pendant Liquid Droplet
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Topics: Acoustics, Drops, Evaporation, Hydrodynamics, Oscillations, Resonance, Waves
Proceedings Papers

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

Takahiro Nagata, Takaya Kobayashi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1181-1186, July 17–22, 2005
Paper No: IPACK2005-73162
DOI: https://doi.org/10.1115/IPACK2005-73162
View Paper titled, Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis
Click here to open pdf in another window PDF for Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis
Topics: Equilibrium (Physics), Finite element analysis, Solders, Stability, Drops, Surface tension, Constitutive equations, Deformation, Fluids, Creep