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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Paper No: IPACK2022-97455
DOI: https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
Click here to open pdf in another window PDF for Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Characterization of 1 st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications

Arun Madyala, Adam Huang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 509-513, July 8–12, 2007
Paper No: IPACK2007-33871
DOI: https://doi.org/10.1115/IPACK2007-33871
View Paper titled, Characterization of 1 st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications
Click here to open pdf in another window PDF for Characterization of 1 st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications
Topics: Aircraft, Elastomers, Microelectromechanical systems, Sensors, Manufacturing, Carbon black pigments, Design, Electrical resistivity, Mechanical properties, Metals
Proceedings Papers

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, David Lutz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 443-450, July 6–11, 2003
Paper No: IPACK2003-35216
DOI: https://doi.org/10.1115/IPACK2003-35216
View Paper titled, System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication
Click here to open pdf in another window PDF for System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication
Topics: Optimization, Temperature, Elastomers, Design, Slug flows, Computer software, Copper, Failure, High temperature, Numerical analysis