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Proceedings Papers

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97218
https://doi.org/10.1115/IPACK2022-97218
View Paper titled, Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process
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Topics: Bonding, Computation, Computer simulation, Deformation, Design, Engineering prototypes, Flow (Dynamics), Levitation, Optimization, Physics
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6434
https://doi.org/10.1115/IPACK2019-6434
View Paper titled, Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger
Open the PDF for Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger in another window
Topics: Cooling, Design, Electric vehicles, Vehicles, Circuits, Density, Dynamics (Mechanics), Energy dissipation, Engineering prototypes, Engineering simulation
Proceedings Papers

Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap

Mahmoud Elzouka, Sidy Ndao
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74212
https://doi.org/10.1115/IPACK2017-74212
View Paper titled, Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap
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Topics: Crystals, Thermal radiation, Heat transfer, Heat, Flow (Dynamics), Radiative heat transfer, Vacuum, Electronics, Engineering prototypes, Numerical analysis
Proceedings Papers

Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation

Viral K. Patel, Kyle R. Gluesenkamp
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74243
https://doi.org/10.1115/IPACK2017-74243
View Paper titled, Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation
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Topics: Design, Drying, Electrical resistance, Energy consumption, Energy efficiency, Engineering prototypes, Heat pumps, Heating, Modeling, Optimization
Proceedings Papers

Users’ Thermal Response to a Simulated Tablet Computer Surface

Han Zhang, Alan Hedge, Beiyuan Guo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48787
https://doi.org/10.1115/IPACK2015-48787
View Paper titled, Users’ Thermal Response to a Simulated Tablet Computer Surface
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Topics: Computers, Temperature, Engineering prototypes, Heat, Heating, Aluminum, Design, Sensors, Skin
Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48027
https://doi.org/10.1115/IPACK2015-48027
View Paper titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
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Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling
Proceedings Papers

A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection

Yichao Yang, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48133
https://doi.org/10.1115/IPACK2015-48133
View Paper titled, A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection
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Topics: Microfluidics, Tactile sensors, Torque, Transducers, Microchannels, Electrolytes, Computer numerical control machine tools, Electrodes, Engineering prototypes, Lithography
Proceedings Papers

Design, Fabrication and Characterization of a Mechanical Micropump

Bin Duan, Tinghui Guo, Minqing Luo, Xiaobing Luo
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A048, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48017
https://doi.org/10.1115/IPACK2015-48017
View Paper titled, Design, Fabrication and Characterization of a Mechanical Micropump
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Topics: Design, Manufacturing, Micropumps, Flow (Dynamics), Blades, Computational fluid dynamics, Emissions, Impellers, Pressure, Pumps
Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48429
https://doi.org/10.1115/IPACK2015-48429
View Paper titled, Advanced Cooling Designs for GaN-on-Diamond MMICs
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Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes
Proceedings Papers

Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink

H. Arthur Kariya, Daniel F. Hanks, Wayne L. Staats, Nicholas A. Roche, Martin Cleary, Teresa B. Peters, John G. Brisson, Evelyn N. Wang
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A027, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73120
https://doi.org/10.1115/IPACK2013-73120
View Paper titled, Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink
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Topics: Condensers (steam plant), Heat pipes, Heat sinks, Heat, Design, Thermal resistance, Cooling, Data centers, Electronic packaging, Engineering prototypes
Proceedings Papers

Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement

Michael J. Hill, Kemal Aygun, Kaladhar Radhakrishnan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 627-631, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52254
https://doi.org/10.1115/IPACK2011-52254
View Paper titled, Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement
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Topics: Capacitors, Thin films, Engineering prototypes
Proceedings Papers

Development of a Metal Micro-Textured Thermal Interface Material

R. Kempers, R. Frizzell, A. Lyons, A. J. Robinson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 587-595, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89366
https://doi.org/10.1115/InterPACK2009-89366
View Paper titled, Development of a Metal Micro-Textured Thermal Interface Material
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Topics: Metals, Thermal conductivity, Fillers (Materials), Particulate matter, Composite materials, Deformation, Engineering prototypes, Flow (Dynamics), Manufacturing, Metal foil
Proceedings Papers

Integrating Novel Packaging Technologies for Large Scale Computer Systems

James Mitchell, John Cunningham, Ashok V. Krishnamoorthy, Robert Drost, Ron Ho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 57-66, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89355
https://doi.org/10.1115/InterPACK2009-89355
View Paper titled, Integrating Novel Packaging Technologies for Large Scale Computer Systems
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Topics: Computers, Packaging, Complementary metal oxide semiconductors, Density, Engineering prototypes, Silicon
Proceedings Papers

Novel Miniature DMFC With Monolithic Si Electrodes

Masanori Hayase, Yosuke Saito
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 459-462, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89143
https://doi.org/10.1115/InterPACK2009-89143
View Paper titled, Novel Miniature DMFC With Monolithic Si Electrodes
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Topics: Direct methanol fuel cells, Electrodes, Catalysts, Plating, Semiconductor wafers, Energy generation, Engineering prototypes, Fuels, Metals, Methanol
Proceedings Papers

Development of New Power MOSFETs Package With Double-Sided Cooling

Kisho Ashida, Akira Muto, Ichio Shimizu, Kenya Kawano, Naotaka Tanaka, Nae Yoneda
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 423-427, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33023
https://doi.org/10.1115/IPACK2007-33023
View Paper titled, Development of New Power MOSFETs Package With Double-Sided Cooling
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Topics: Cooling, Solders, Fracture (Materials), Thermal resistance, Copper, Fatigue, Fatigue life, Packaging, Structural optimization, Crack propagation
Proceedings Papers

Design Optimization of Fixed-Valve Micropumps for Miniature Cooling Systems

Fred K. Forster, Travis Walter
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 137-145, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33829
https://doi.org/10.1115/IPACK2007-33829
View Paper titled, Design Optimization of Fixed-Valve Micropumps for Miniature Cooling Systems
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Topics: Cooling systems, Design, Micropumps, Optimization, Valves, Pumps, Flow (Dynamics), Pressure, Stress, Actuators
Proceedings Papers

Theta_JC Metrology Development: Fixture Design Modeling

Michael Butch M. Dizon, Suzana Prstic, Sung-Won Moon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 569-576, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73405
https://doi.org/10.1115/IPACK2005-73405
View Paper titled, Theta_JC Metrology Development: Fixture Design Modeling
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Topics: Design, Metrology, Modeling, Errors, Computational fluid dynamics, Heat losses, Insulation, Junctions, Temperature, Cavities
Proceedings Papers

A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects

Bing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 605-610, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73416
https://doi.org/10.1115/IPACK2005-73416
View Paper titled, A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects
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Topics: Cooling, Heat sinks, Microfluidics, Silicon chips, Complementary metal oxide semiconductors, Density, Electroplating, Engineering prototypes, Flip-chip, Flip-chip assemblies
Proceedings Papers

Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range

Takashi Fukushige, Seiichi Hata, Takehiko Hayashi, Akira Shimokohbe
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1709-1713, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73145
https://doi.org/10.1115/IPACK2005-73145
View Paper titled, Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range
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Topics: Design, Microactuators, Cantilevers, Electrodes, Engineering prototypes, Shapes, Control systems, Deflection, Design methodology, Equilibrium (Physics)