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Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Paper No: IPACK2022-97433
DOI: https://doi.org/10.1115/IPACK2022-97433
View Paper titled, Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Click here to open pdf in another window PDF for Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Proceedings Papers

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Cody J. Marbut, Mahsa Montazeri, David Huitink
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 27–30, 2018
Paper No: IPACK2018-8275
DOI: https://doi.org/10.1115/IPACK2018-8275
View Paper titled, Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction
Click here to open pdf in another window PDF for Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction
Topics: Fatigue failure, Reliability, Stress, Damage, Design, Fatigue, Finite element analysis, Solders, Failure, Flip-chip
Proceedings Papers

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 27–30, 2018
Paper No: IPACK2018-8414
DOI: https://doi.org/10.1115/IPACK2018-8414
View Paper titled, Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
Click here to open pdf in another window PDF for Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
Topics: Solders, Fracture (Materials), Solder joints, Temperature, Damage, Electronic packages, Fatigue failure, Glass, Intermetallic compounds, Lead-free solders
Proceedings Papers

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling

Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A033, July 6–9, 2015
Paper No: IPACK2015-48009
DOI: https://doi.org/10.1115/IPACK2015-48009
View Paper titled, Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling
Click here to open pdf in another window PDF for Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling
Topics: Event history analysis, Solder joints, Tin, Ball-Grid-Array packaging, Fatigue failure, Finishes, Intermetallic compounds, Solders
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Paper No: IPACK2015-48247
DOI: https://doi.org/10.1115/IPACK2015-48247
View Paper titled, Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
Click here to open pdf in another window PDF for Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Y. Sing Chan, F. B. Song, S. W. Ricky Lee, C. R. Yang, Jeffery C. C. Lo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 579-583, July 6–8, 2011
Paper No: IPACK2011-52219
DOI: https://doi.org/10.1115/IPACK2011-52219
View Paper titled, Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test
Click here to open pdf in another window PDF for Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test
Topics: Chain, Fatigue cracks, Lead-free solders, Temperature, Solder joints, Electrical resistance, Failure, Fatigue, Fatigue failure, Fracture (Materials)
Proceedings Papers

Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 207-211, July 6–8, 2011
Paper No: IPACK2011-52112
DOI: https://doi.org/10.1115/IPACK2011-52112
View Paper titled, Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump
Click here to open pdf in another window PDF for Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump
Topics: Fatigue life, Lead-free solders, Electronic components, Electronic packages, Electronic products, Fatigue, Fatigue damage, Fatigue failure, Finite element analysis, Reliability
Proceedings Papers

Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 213-224, July 6–8, 2011
Paper No: IPACK2011-52133
DOI: https://doi.org/10.1115/IPACK2011-52133
View Paper titled, Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method
Click here to open pdf in another window PDF for Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method
Topics: Principal component analysis, Transients (Dynamics), Heating, Integrated circuits, Joules, Microelectronic devices, Circuits, Failure, Fatigue failure, Finite element analysis
Proceedings Papers

High Strain Rate Behavior of Sn3.8Ag0.7Cu Solder Alloys and Its Influence on the Fracture Location Within Solder Joints

Dennis Chan, Xu Nie, Dhruv Bhate, Ganesh Subbarayan, Indranath Dutta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 989-995, July 19–23, 2009
Paper No: InterPACK2009-89404
DOI: https://doi.org/10.1115/InterPACK2009-89404
View Paper titled, High Strain Rate Behavior of Sn3.8Ag0.7Cu Solder Alloys and Its Influence on the Fracture Location Within Solder Joints
Click here to open pdf in another window PDF for High Strain Rate Behavior of Sn3.8Ag0.7Cu Solder Alloys and Its Influence on the Fracture Location Within Solder Joints
Topics: Alloys, Fracture (Materials), Fracture (Process), Solder joints, Solders, Failure, Intermetallic compounds, Engineering simulation, Failure mechanisms, Fatigue failure
Proceedings Papers

A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1341-1346, July 17–22, 2005
Paper No: IPACK2005-73493
DOI: https://doi.org/10.1115/IPACK2005-73493
View Paper titled, A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages
Click here to open pdf in another window PDF for A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages
Topics: Delamination, Flip-chip packages, Fracture mechanics, Fatigue, Flip-chip, Flip-chip devices, Solders, Adhesives, Computer simulation, Displacement
Proceedings Papers

Deformation and Fatigue Fracture of Pb-Free Solder Alloys Under Complicated Load Conditions

J. Liang, N. Dariavach, P. Callahan, D. Shangguan, X. Li
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 927-938, July 17–22, 2005
Paper No: IPACK2005-73257
DOI: https://doi.org/10.1115/IPACK2005-73257
View Paper titled, Deformation and Fatigue Fracture of Pb-Free Solder Alloys Under Complicated Load Conditions
Click here to open pdf in another window PDF for Deformation and Fatigue Fracture of Pb-Free Solder Alloys Under Complicated Load Conditions
Topics: Alloys, Deformation, Fatigue, Fracture (Materials), Fracture (Process), Lead-free solders, Stress, Solders, Temperature, Die cutting