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Proceedings Papers

Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers

Callum Chhokar, G. Bamorovat Abadi, Nicholas McDaniel, Chris Botting, Majid Bahrami
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A010, October 25–27, 2022
Paper No: IPACK2022-98077
DOI: https://doi.org/10.1115/IPACK2022-98077
View Paper titled, Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers
Click here to open pdf in another window PDF for Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers
Topics: Batteries, Fins, Heat sinks
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Paper No: IPACK2021-72975
DOI: https://doi.org/10.1115/IPACK2021-72975
View Paper titled, Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
Click here to open pdf in another window PDF for Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Paper No: IPACK2021-73015
DOI: https://doi.org/10.1115/IPACK2021-73015
View Paper titled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
Click here to open pdf in another window PDF for Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Paper No: IPACK2020-2569
DOI: https://doi.org/10.1115/IPACK2020-2569
View Paper titled, An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow
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Topics: Air flow, Computer cooling, Cooling, Design, Fins, Flow (Dynamics), Forced convection, Heat flux, Heat sinks, Heat transfer
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Paper No: IPACK2020-2542
DOI: https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
Click here to open pdf in another window PDF for Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Paper No: IPACK2020-2627
DOI: https://doi.org/10.1115/IPACK2020-2627
View Paper titled, Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product
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Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Paper No: IPACK2015-48242
DOI: https://doi.org/10.1115/IPACK2015-48242
View Paper titled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
Click here to open pdf in another window PDF for Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Paper No: IPACK2015-48123
DOI: https://doi.org/10.1115/IPACK2015-48123
View Paper titled, Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics
Click here to open pdf in another window PDF for Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics
Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation
Proceedings Papers

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Sohail R. Reddy, George S. Dulikravich
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A019, July 6–9, 2015
Paper No: IPACK2015-48346
DOI: https://doi.org/10.1115/IPACK2015-48346
View Paper titled, Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature
Click here to open pdf in another window PDF for Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature
Topics: Coolants, Cooling, Design, Temperature, Heat, Heat flux, Fluids, Flux (Metallurgy), Airfoils, Computer cooling
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Paper No: IPACK2015-48122
DOI: https://doi.org/10.1115/IPACK2015-48122
View Paper titled, Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
Click here to open pdf in another window PDF for Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
DOI: https://doi.org/10.1115/IPACK2015-48592
View Paper titled, Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
Click here to open pdf in another window PDF for Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Orientation Effects on Thermal Performance of Radial Heat Sinks Subject to Natural Convection

Bin Li, Chan Byon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A003, July 6–9, 2015
Paper No: IPACK2015-48191
DOI: https://doi.org/10.1115/IPACK2015-48191
View Paper titled, Orientation Effects on Thermal Performance of Radial Heat Sinks Subject to Natural Convection
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Topics: Heat sinks, Natural convection, Computer simulation, Finite volume methods, Fins, Gravity (Force), Heat transfer, Radiation (Physics)
Proceedings Papers

Small-Scale Vorticity Induced by a Self-Oscillating Fluttering Reed for Heat Transfer Augmentation in Air Cooled Heat Sinks

Pablo Hidalgo, Ari Glezer
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A004, July 6–9, 2015
Paper No: IPACK2015-48511
DOI: https://doi.org/10.1115/IPACK2015-48511
View Paper titled, Small-Scale Vorticity Induced by a Self-Oscillating Fluttering Reed for Heat Transfer Augmentation in Air Cooled Heat Sinks
Click here to open pdf in another window PDF for Small-Scale Vorticity Induced by a Self-Oscillating Fluttering Reed for Heat Transfer Augmentation in Air Cooled Heat Sinks
Topics: Heat sinks, Heat transfer, Vorticity, Flow (Dynamics), Fluids, Heat transfer coefficients, Cooling, Energy dissipation, Fins, Heat flux
Proceedings Papers

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

Kazuma Obata, Takashi Fukue, Koichi Hirose, Mamoru Kikuchi, Yasuhiko Ueda, Shigekado Kusabuka, Tomoyasu Miyahara
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A045, July 6–9, 2015
Paper No: IPACK2015-48607
DOI: https://doi.org/10.1115/IPACK2015-48607
View Paper titled, Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators
Click here to open pdf in another window PDF for Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators
Topics: Cooling, Flow (Dynamics), Generators, Heat sinks, Vortices, Water, Heat, Density, Electric vehicles, Energy dissipation
Proceedings Papers

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

Suchismita Sarangi, Will A. Kuhn, Scott Rider, Claude Wright, Shankar Krishnan
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A046, July 6–9, 2015
Paper No: IPACK2015-48640
DOI: https://doi.org/10.1115/IPACK2015-48640
View Paper titled, Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters
Click here to open pdf in another window PDF for Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters
Topics: Cooling, Fluids, Temperature, Boiling, Bose-Einstein condensates, Air flow, Coating processes, Coatings, Coolants, Engineering standards
Proceedings Papers

Enhanced Melting for Transient Thermal Management

T. Rozenfeld, R. Hayat, Y. Kozak, G. Ziskind
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A063, July 6–9, 2015
Paper No: IPACK2015-48369
DOI: https://doi.org/10.1115/IPACK2015-48369
View Paper titled, Enhanced Melting for Transient Thermal Management
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Topics: Melting, Thermal management, Transients (Dynamics), Fins, Phase change materials, Heat transfer, Energy dissipation, Geometry, Heat, Latent heat
Proceedings Papers

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A056, July 6–9, 2015
Paper No: IPACK2015-48537
DOI: https://doi.org/10.1115/IPACK2015-48537
View Paper titled, Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers
Click here to open pdf in another window PDF for Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers
Topics: Coolers, Fins, Computer simulation, Cooling, Density, Flow (Dynamics), Flux (Metallurgy), Heat, Coolants, Design
Proceedings Papers

CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels

Omer Bugra Kanargi, Christopher Yap, Poh Seng Lee
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A083, July 6–9, 2015
Paper No: IPACK2015-48277
DOI: https://doi.org/10.1115/IPACK2015-48277
View Paper titled, CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels
Click here to open pdf in another window PDF for CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels
Topics: Computational fluid dynamics, Heat sinks, Flow (Dynamics), Cross connections, Heat transfer, Pressure, Thermal boundary layers, Air flow, Convection, Design
Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013
Paper No: IPACK2013-73028
DOI: https://doi.org/10.1115/IPACK2013-73028
View Paper titled, Applications of Cold Plate Units With Micro-Channel for Cooling Electronics
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Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design
Proceedings Papers

Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels

Susan N. Ritchey, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A012, July 16–18, 2013
Paper No: IPACK2013-73058
DOI: https://doi.org/10.1115/IPACK2013-73058
View Paper titled, Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels
Click here to open pdf in another window PDF for Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels
Topics: Heating, Microchannels, Two-phase flow, Heat sinks, Flow (Dynamics), Heat, Flux (Metallurgy), Heat flux, Boiling, Diluents