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Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Paper No: IPACK2022-97429
DOI: https://doi.org/10.1115/IPACK2022-97429
View Paper titled, Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
Click here to open pdf in another window PDF for Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model

Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Paper No: IPACK2022-97421
DOI: https://doi.org/10.1115/IPACK2022-97421
View Paper titled, Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
Click here to open pdf in another window PDF for Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
Topics: Cooling, Plates (structures), Thermal resistance, Flow (Dynamics), Pressure drop, Computational fluid dynamics, Coolants, Cooling systems, Engineering simulation, Fluids
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Paper No: IPACK2022-97416
DOI: https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
Click here to open pdf in another window PDF for Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Paper No: IPACK2022-97218
DOI: https://doi.org/10.1115/IPACK2022-97218
View Paper titled, Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process
Click here to open pdf in another window PDF for Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process
Topics: Bonding, Computation, Computer simulation, Deformation, Design, Engineering prototypes, Flow (Dynamics), Levitation, Optimization, Physics
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
DOI: https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Click here to open pdf in another window PDF for Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

Deogratius Kisitu, Carol Caceres, Metodi Zlatinov, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 25–27, 2022
Paper No: IPACK2022-97400
DOI: https://doi.org/10.1115/IPACK2022-97400
View Paper titled, Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling
Click here to open pdf in another window PDF for Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling
Topics: Boiling, Computer cooling, Cooling, Copper, Flow (Dynamics), Heat flux, Metal foams
Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Paper No: IPACK2022-97447
DOI: https://doi.org/10.1115/IPACK2022-97447
View Paper titled, Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
Click here to open pdf in another window PDF for Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Click here to open pdf in another window PDF for Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Paper No: IPACK2021-74016
DOI: https://doi.org/10.1115/IPACK2021-74016
View Paper titled, Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
Click here to open pdf in another window PDF for Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Paper No: IPACK2021-72621
DOI: https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
Click here to open pdf in another window PDF for Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021
Paper No: IPACK2021-72976
DOI: https://doi.org/10.1115/IPACK2021-72976
View Paper titled, CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate
Click here to open pdf in another window PDF for CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate
Topics: Computational fluid dynamics, Cooling, Flow (Dynamics), Impellers, Density, Electronic equipment, Packaging, Fans, Flow visualization, Pressure
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Paper No: IPACK2021-72975
DOI: https://doi.org/10.1115/IPACK2021-72975
View Paper titled, Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
Click here to open pdf in another window PDF for Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 26–28, 2021
Paper No: IPACK2021-73313
DOI: https://doi.org/10.1115/IPACK2021-73313
View Paper titled, Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
Click here to open pdf in another window PDF for Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
Topics: Coatings, Coolants, Cooling, Design, Durability, Electric fields, Electronics, Flow (Dynamics), Fluids, Heat
Proceedings Papers

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 26–28, 2021
Paper No: IPACK2021-66842
DOI: https://doi.org/10.1115/IPACK2021-66842
View Paper titled, Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements
Click here to open pdf in another window PDF for Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements
Topics: Electrical conductance, Thermoreflectance, Transducers, Thermal resistance, Architecture, Computer simulation, Electronic packaging, Fittings, Flow (Dynamics), Geometry
Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Paper No: IPACK2021-73253
DOI: https://doi.org/10.1115/IPACK2021-73253
View Paper titled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Click here to open pdf in another window PDF for BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement

Deogratius Kisitu, Alfonso Ortega
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 26–28, 2021
Paper No: IPACK2021-73283
DOI: https://doi.org/10.1115/IPACK2021-73283
View Paper titled, Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement
Click here to open pdf in another window PDF for Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement
Topics: Cooling, Flow (Dynamics), Microchannels, Plates (structures)
Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Paper No: IPACK2021-72612
DOI: https://doi.org/10.1115/IPACK2021-72612
View Paper titled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
Click here to open pdf in another window PDF for Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Paper No: IPACK2020-2541
DOI: https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
Click here to open pdf in another window PDF for Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers

Fabio Battaglia, Raphael Mandel, Amir Shooshtari, Michael M. Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 27–29, 2020
Paper No: IPACK2020-2564
DOI: https://doi.org/10.1115/IPACK2020-2564
View Paper titled, A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers
Click here to open pdf in another window PDF for A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers
Topics: Flow (Dynamics), Heat exchangers, Heat transfer, Manifolds, Microchannels, Modeling, Porous materials
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Paper No: IPACK2020-2605
DOI: https://doi.org/10.1115/IPACK2020-2605
View Paper titled, Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
Click here to open pdf in another window PDF for Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration