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Proceedings Papers

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
DOI: https://doi.org/10.1115/IPACK2022-97424
View Paper titled, Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Click here to open pdf in another window PDF for Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Topics: Delamination, Fatigue, Fracture toughness, Temperature
Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Paper No: IPACK2021-74062
DOI: https://doi.org/10.1115/IPACK2021-74062
View Paper titled, Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
Click here to open pdf in another window PDF for Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Paper No: IPACK2020-2676
DOI: https://doi.org/10.1115/IPACK2020-2676
View Paper titled, Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
Click here to open pdf in another window PDF for Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep, Ryan Lowe
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 7–9, 2019
Paper No: IPACK2019-6572
DOI: https://doi.org/10.1115/IPACK2019-6572
View Paper titled, Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading
Click here to open pdf in another window PDF for Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading
Topics: Bending (Stress), Delamination, Electronics, Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Fracture toughness
Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Paper No: IPACK2018-8254
DOI: https://doi.org/10.1115/IPACK2018-8254
View Paper titled, Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
Click here to open pdf in another window PDF for Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Paper No: IPACK2017-74279
DOI: https://doi.org/10.1115/IPACK2017-74279
View Paper titled, Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
Click here to open pdf in another window PDF for Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 29–September 1, 2017
Paper No: IPACK2017-74322
DOI: https://doi.org/10.1115/IPACK2017-74322
View Paper titled, Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures
Click here to open pdf in another window PDF for Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures
Topics: Bending (Stress), Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, Temperature, Fracture (Materials), Elongation, Shock (Mechanics), Failure
Proceedings Papers

Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages

Babak Talebanpour, Indranath Dutta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A003, July 6–9, 2015
Paper No: IPACK2015-48125
DOI: https://doi.org/10.1115/IPACK2015-48125
View Paper titled, Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages
Click here to open pdf in another window PDF for Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages
Topics: Fracture (Materials), Solders, Tin, Fracture toughness, Failure, Brittleness, Ductile fracture, Electronic packages, Fractography, Fracture mechanics
Proceedings Papers

Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging

Z. Huang, I. Dutta, G. S. Subbarayan
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A003, July 16–18, 2013
Paper No: IPACK2013-73079
DOI: https://doi.org/10.1115/IPACK2013-73079
View Paper titled, Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging
Click here to open pdf in another window PDF for Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging
Topics: Fracture (Materials), Fracture (Process), Solders, Tin, Brittleness, Fracture mechanics, Fracture toughness, Solder joints, Adhesives, Ball-Grid-Array packaging
Proceedings Papers

High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates

Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar, R. Mahajan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 763-771, July 6–8, 2011
Paper No: IPACK2011-52220
DOI: https://doi.org/10.1115/IPACK2011-52220
View Paper titled, High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates
Click here to open pdf in another window PDF for High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates
Topics: Fracture (Materials), Fracture (Process), Solder joints, Tin, Fracture toughness, Solders, Yield strength, Failure, Intermetallic compounds, Microcracks
Proceedings Papers

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

Chang Yong Ha, Soo Il Lee
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 179-184, July 6–8, 2011
Paper No: IPACK2011-52100
DOI: https://doi.org/10.1115/IPACK2011-52100
View Paper titled, Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging
Click here to open pdf in another window PDF for Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging
Topics: Bonding, Integrated circuits, Optimization, Packaging, Topology, Design, Modal assurance criterion, Vibration, Errors, Finite element model
Proceedings Papers

Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Abhishek Tambat, Hung-Yun Lin, Ian Claydon, Ganesh Subbarayan, Dae-Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 317-323, July 6–8, 2011
Paper No: IPACK2011-52237
DOI: https://doi.org/10.1115/IPACK2011-52237
View Paper titled, Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection
Click here to open pdf in another window PDF for Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection
Topics: Dielectric materials, Fracture (Materials), Modeling, Failure, Fracture (Process), Fracture toughness, Boundary-value problems, Computer-aided design, Crack propagation, Displacement
Proceedings Papers

Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 425-428, July 6–8, 2011
Paper No: IPACK2011-52270
DOI: https://doi.org/10.1115/IPACK2011-52270
View Paper titled, Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages
Click here to open pdf in another window PDF for Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages
Topics: Electromagnetic scattering, Focused ion beams, Fracture toughness, Microscale devices, Resolution (Optics), Uncertainty, Vapors
Proceedings Papers

SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys

Pradeep Lall, Mandar Kulkarni, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 281-297, July 6–8, 2011
Paper No: IPACK2011-52196
DOI: https://doi.org/10.1115/IPACK2011-52196
View Paper titled, SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys
Click here to open pdf in another window PDF for SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys
Topics: Alloys, Springs, Copper, Solders, Fracture (Materials), Shock (Mechanics), Failure, Fracture toughness, Stress, Ball-Grid-Array packages
Proceedings Papers

Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multi-Modal Failure Distribution

Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 401-409, July 19–23, 2009
Paper No: InterPACK2009-89311
DOI: https://doi.org/10.1115/InterPACK2009-89311
View Paper titled, Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multi-Modal Failure Distribution
Click here to open pdf in another window PDF for Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multi-Modal Failure Distribution
Topics: Failure, Fracture toughness, Blades, Lasers, Fracture (Materials), Fracture (Process), Failure mechanisms, Fractography
Proceedings Papers

Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

Kisho Ashida, Kenya Kawano, Naotaka Tanaka, Atsushi Nishikizawa, Nobuya Koike
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 825-831, July 19–23, 2009
Paper No: InterPACK2009-89273
DOI: https://doi.org/10.1115/InterPACK2009-89273
View Paper titled, Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering
Click here to open pdf in another window PDF for Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering
Topics: Adhesives, Bonding, Reflow soldering, Silver, Fracture (Process), Fracture toughness, Copper, Failure, Resins, Stress
Proceedings Papers

Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading

Nikhil Lakhkar, Mohammad M. Hossain, Puligandla Viswanadham, Dereje Agonafer
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 557-562, July 8–12, 2007
Paper No: IPACK2007-33543
DOI: https://doi.org/10.1115/IPACK2007-33543
View Paper titled, Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading
Click here to open pdf in another window PDF for Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading
Topics: Solders, Tin, Temperature, Copper, Electronic packages, Electronic packaging, Fatigue life, Fracture (Materials), Fracture toughness, Lead-free solders
Proceedings Papers

Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1237-1252, July 17–22, 2005
Paper No: IPACK2005-73348
DOI: https://doi.org/10.1115/IPACK2005-73348
View Paper titled, Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies
Click here to open pdf in another window PDF for Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies
Topics: Delamination, Flip-chip assemblies, Stress, Flip-chip, Flip-chip devices, Sensors, Silicon, Cycles, Manufacturing, Solder joints
Proceedings Papers

An Engineering Model for Moisture Degradation of Polymer/Metal Interfacial Fracture Toughness

Timothy P. Ferguson, Jianmin Qu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1661-1664, July 17–22, 2005
Paper No: IPACK2005-73414
DOI: https://doi.org/10.1115/IPACK2005-73414
View Paper titled, An Engineering Model for Moisture Degradation of Polymer/Metal Interfacial Fracture Toughness
Click here to open pdf in another window PDF for An Engineering Model for Moisture Degradation of Polymer/Metal Interfacial Fracture Toughness
Topics: Engineering models, Fracture toughness, Metals, Polymers, Fracture mechanics, Hydrophobicity
Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

J. Varghese, A. Dasgupta
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 845-848, July 17–22, 2005
Paper No: IPACK2005-73014
DOI: https://doi.org/10.1115/IPACK2005-73014
View Paper titled, Failure Site Transition During Drop Testing of Printed Wiring Assemblies
Click here to open pdf in another window PDF for Failure Site Transition During Drop Testing of Printed Wiring Assemblies
Topics: Electrical wires, Failure, Testing, Durability, Intermetallic compounds, Solders, Damage, Surface mount packaging, Brittleness, Deformation