1-20 of 120
Lead-free solders
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022
Paper No: IPACK2022-93878
https://doi.org/10.1115/IPACK2022-93878
View Paper titled, Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder
Open the PDF for Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder in another window
Topics: Creep, Damage, Lead-free solders, Solders
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Open the PDF for Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration in another window
Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021
Paper No: IPACK2021-73548
https://doi.org/10.1115/IPACK2021-73548
View Paper titled, Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys
Open the PDF for Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys in another window
Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature
Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021
Paper No: IPACK2021-74069
https://doi.org/10.1115/IPACK2021-74069
View Paper titled, Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months
Open the PDF for Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months in another window
Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages
Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021
Paper No: IPACK2021-73348
https://doi.org/10.1115/IPACK2021-73348
View Paper titled, Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints
Open the PDF for Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints in another window
Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
Open the PDF for Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures in another window
Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
Open the PDF for Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging in another window
Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Paper No: IPACK2020-2658
https://doi.org/10.1115/IPACK2020-2658
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Open the PDF for Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys in another window
Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines
Proceedings Papers

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020
Paper No: IPACK2020-2659
https://doi.org/10.1115/IPACK2020-2659
View Paper titled, High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging
Open the PDF for High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging in another window
Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020
Paper No: IPACK2020-2660
https://doi.org/10.1115/IPACK2020-2660
View Paper titled, High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging
Open the PDF for High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging in another window
Topics: High temperature, Mechanical properties, Testing, Alloys, Operating temperature, Solders, Stress, Aerospace industry, Biomedicine, Electronic components
Proceedings Papers

Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 27–29, 2020
Paper No: IPACK2020-2692
https://doi.org/10.1115/IPACK2020-2692
View Paper titled, Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling
Open the PDF for Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling in another window
Topics: Lead-free solders, Recrystallization, Shear (Mechanics)
Proceedings Papers

Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 27–29, 2020
Paper No: IPACK2020-2693
https://doi.org/10.1115/IPACK2020-2693
View Paper titled, Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling
Open the PDF for Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling in another window
Topics: Creep, Lead-free solders
Proceedings Papers

Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 27–29, 2020
Paper No: IPACK2020-2691
https://doi.org/10.1115/IPACK2020-2691
View Paper titled, Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging
Open the PDF for Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging in another window
Topics: Ball-Grid-Array packaging, High temperature, Lead-free solders, Particulate matter
Proceedings Papers

Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019
Paper No: IPACK2019-6560
https://doi.org/10.1115/IPACK2019-6560
View Paper titled, Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading
Open the PDF for Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading in another window
Topics: Lead-free solders
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 7–9, 2019
Paper No: IPACK2019-6576
https://doi.org/10.1115/IPACK2019-6576
View Paper titled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C
Open the PDF for High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C in another window
Topics: Mechanical properties, Storage, Temperature, Alloys, Operating temperature, Electronic components, Electronics, High temperature, Lead-free solders, Shock (Mechanics)
Proceedings Papers

Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 7–9, 2019
Paper No: IPACK2019-6562
https://doi.org/10.1115/IPACK2019-6562
View Paper titled, Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders
Open the PDF for Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders in another window
Topics: Lead-free solders, Stress, Temperature
Proceedings Papers

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019
Paper No: IPACK2019-6521
https://doi.org/10.1115/IPACK2019-6521
View Paper titled, Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects
Open the PDF for Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects in another window
Topics: Electrodiffusion, Failure, Lead-free solders
Proceedings Papers

Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 7–9, 2019
Paper No: IPACK2019-6563
https://doi.org/10.1115/IPACK2019-6563
View Paper titled, Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder
Open the PDF for Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder in another window
Topics: Cycles, Lead-free solders, Stress-strain curves, Tensile strength, Thermal shock
Proceedings Papers

Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints

Mohd Aminul Hoque, Md Mahmudur Chowdhury, Sa’d Hamasha, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 7–9, 2019
Paper No: IPACK2019-6567
https://doi.org/10.1115/IPACK2019-6567
View Paper titled, Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints
Open the PDF for Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints in another window
Topics: Creep, Lead-free solders, Mechanical properties, Nanoindentation, Shear (Mechanics)
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Paper No: IPACK2019-6577
https://doi.org/10.1115/IPACK2019-6577
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Open the PDF for Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys in another window
Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics