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Proceedings Papers

Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform

Pradeep Lall, Ved Soni, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112056
https://doi.org/10.1115/IPACK2023-112056
View Paper titled, Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform
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Topics: Electronics, Machine learning, Printing
Proceedings Papers

Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics

Janhavi Giri, Attila Lengyel
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111525
https://doi.org/10.1115/IPACK2023-111525
View Paper titled, Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics
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Topics: Machine learning, Manufacturing, Semiconductor wafers, Topology
Proceedings Papers

Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors

Carlton Knox, Zihao Yuan, Ayse K. Coskun
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96751
https://doi.org/10.1115/IPACK2022-96751
View Paper titled, Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors
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Topics: Machine learning, Simulation, Temperature
Proceedings Papers

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97481
https://doi.org/10.1115/IPACK2022-97481
View Paper titled, Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling
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Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat sinks, Machine learning, Machinery, Optimization, Thermal management
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

AI/ML Applications for Thermally Aware SoC Designs

Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97186
https://doi.org/10.1115/IPACK2022-97186
View Paper titled, AI/ML Applications for Thermally Aware SoC Designs
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Topics: Computation, Degrees of freedom, Design, Engineering disciplines, Excitation, Feedback, Machine learning, Modeling, Optimization, Robustness
Proceedings Papers

ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging

Pradeep Lall, Hyesoo Jang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97431
https://doi.org/10.1115/IPACK2022-97431
View Paper titled, ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging
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Topics: Artificial neural networks, Batteries, Lithium-ion batteries, Machine learning, Reliability, Simulation
Proceedings Papers

Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions

Nhi V. Quach, Jewoo Park, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Alex K. Lee, Chenxi Yin, Yoonjin Won
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96542
https://doi.org/10.1115/IPACK2022-96542
View Paper titled, Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions
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Topics: Autonomous vehicles, Machine learning
Proceedings Papers

Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

John Kim, Raffaele L. Amalfi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72618
https://doi.org/10.1115/IPACK2021-72618
View Paper titled, Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications
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Topics: Computer cooling, Heat transfer, Machine learning, Machinery, Refrigerants, Two-phase flow
Proceedings Papers

Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process

Shunsuke Kawasaki, Shinichi Kuramoto, Kazuyoshi Fushinobu, Koichi Kato, Kimiharu Yamazaki, Kaori Hemmi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6396
https://doi.org/10.1115/IPACK2019-6396
View Paper titled, Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process
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Topics: Machine learning, Temperature
Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8305
https://doi.org/10.1115/IPACK2018-8305
View Paper titled, Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling
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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing