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Proceedings Papers

Two-Dimensional Monolayer MX 2 (M=Mo, W; X=S, Se) Synthesis, Characterization and Device Applications

Bin Xiang, Lei Yang, Jian Huang, Qi Fu
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A001, July 6–9, 2015
Paper No: IPACK2015-48286
DOI: https://doi.org/10.1115/IPACK2015-48286
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Topics: Atomic force microscopy, Chemical vapor deposition, Electronics, Emergencies, Mechanical admittance, Optoelectronic devices, Photoluminescence, Pressure, Raman spectroscopy, Resolution (Optics)
Proceedings Papers

Art and Science Towards Noiseless Driving of Liquid Metal for Advanced Thermal Management of High Heat Flux Device

Jing Liu, Zhong-Shan Deng, Zhi-Zhu He
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A059, July 6–9, 2015
Paper No: IPACK2015-48698
DOI: https://doi.org/10.1115/IPACK2015-48698
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Topics: Heat flux, Liquid metals, Thermal management, Cooling, Coolants, Flow (Dynamics), Energy consumption, Heat, Batteries, Design
Proceedings Papers

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, David A. Brooks, Marc Hodes, Matthew van Lieshout, Vincent P. Manno
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 37-45, July 6–8, 2011
Paper No: IPACK2011-52019
DOI: https://doi.org/10.1115/IPACK2011-52019
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Topics: Heat, Temperature control, Heat sinks, Temperature, Energy consumption, Algorithms, Thermal resistance, Circuits, Currents, Electrical resistivity
Proceedings Papers

A Novel Precision Die Attach Technique for Opto-Electronics Packaging

V. Bhagavatula, S. Chaparala, J. Himmelreich
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 1-7, July 6–8, 2011
Paper No: IPACK2011-52028
DOI: https://doi.org/10.1115/IPACK2011-52028
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Topics: Gravity (Force), Lasers, Optoelectronic devices, Packaging
Proceedings Papers

Role of Interface Thermal Boundary Resistance, Straining, and Morphology in Thermal Conductivity of a Set of Si-Ge Superlattices and Biomimetic Si-Ge Nanocomposites

Vikas Samvedi, Vikas Tomar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 361-367, July 6–8, 2011
Paper No: IPACK2011-52284
DOI: https://doi.org/10.1115/IPACK2011-52284
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Topics: Biomimetics, Interfacial thermal resistance, Nanocomposites, Superlattices, Thermal conductivity, Nanoscale phenomena, Nanostructures , Temperature, Engineering simulation, Equilibrium (Physics)
Proceedings Papers

Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 261-265, July 19–23, 2009
Paper No: InterPACK2009-89221
DOI: https://doi.org/10.1115/InterPACK2009-89221
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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Electricity), Polarization (Light), Polarization (Waves), Fibers, Engineering design processes, Experimental design, Manufacturing technology
Proceedings Papers

Superlattice Thermoelectrics for Thermal Management of Electronics and Optoelectronics

R. Venkatasubramanian, B. O’Quinn, R. Alley, E. Siivola, A. Reddy, M. Soto, P. Addepalli
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2147-2152, July 17–22, 2005
Paper No: IPACK2005-73198
DOI: https://doi.org/10.1115/IPACK2005-73198
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Topics: Electronics, Optoelectronic devices, Superlattices, Thermal management, Reliability, Cooling, Refrigeration, Thin films
Proceedings Papers

Structural Analysis of Microelectronic and Photonic Systems

E. Suhir
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 907-920, July 17–22, 2005
Paper No: IPACK2005-73249
DOI: https://doi.org/10.1115/IPACK2005-73249
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Topics: Photonic systems, Structural analysis, Modeling, Design, ASME honors and awards, Engineering disciplines, Engineering research, Experimental methods, Fibers, Finite element analysis
Proceedings Papers

Qualification and Reliability Testing of a Microchip Laser System for Space Applications

M. W. Wright, D. Franzen, H. Hemmati, M. Sandor
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 879-883, July 6–11, 2003
Paper No: IPACK2003-35298
DOI: https://doi.org/10.1115/IPACK2003-35298
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Topics: Accelerated life testing, Integrated circuits, Lasers, Testing, Temperature, Construction, Crystals, Fibers, Flow (Dynamics), Instrumentation
Proceedings Papers

Towards Next Generation of Switching

Alex Vukovic, Michel Savoie, Heng Hua
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 25-28, July 6–11, 2003
Paper No: IPACK2003-35043
DOI: https://doi.org/10.1115/IPACK2003-35043
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Topics: Blocks (Building materials), Optoelectronic devices, Storage, Switches, Traffic, Wavelength