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Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Paper No: IPACK2021-74074
DOI: https://doi.org/10.1115/IPACK2021-74074
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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration
Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Paper No: IPACK2018-8322
DOI: https://doi.org/10.1115/IPACK2018-8322
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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine
Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Paper No: IPACK2017-74158
DOI: https://doi.org/10.1115/IPACK2017-74158
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Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics
Proceedings Papers

The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick

Joon Hong Boo, Hyun Gon Kim, Chang Woo Han
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 29–September 1, 2017
Paper No: IPACK2017-74095
DOI: https://doi.org/10.1115/IPACK2017-74095
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Topics: Computer cooling, Heat pipes, Stress, Thermal resistance, Fluids, Wire screens, Containers, Cooling, Copper, Density
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Paper No: IPACK2017-74107
DOI: https://doi.org/10.1115/IPACK2017-74107
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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices

Hafiz M. Hashim, Baris Dogruoz, Mehmet Arik, Murat Parlak
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A040, July 6–9, 2015
Paper No: IPACK2015-48024
DOI: https://doi.org/10.1115/IPACK2015-48024
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Topics: Axial flow, Computational fluid dynamics, Performance characterization, Flow (Dynamics), Engineering simulation, Engineers, Fans, Pressure, Pressure drop, Simulation
Proceedings Papers

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Paper No: IPACK2015-48175
DOI: https://doi.org/10.1115/IPACK2015-48175
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Topics: Natural convection, Performance characterization, Vapors, Heat, Flat heat pipes, Computer simulation, Condensers (steam plant), Energy dissipation, Heat losses, Temperature distribution
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Paper No: IPACK2015-48457
DOI: https://doi.org/10.1115/IPACK2015-48457
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Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Vibhash Jha, Serguei Dessiatoun, Michael Ohadi, Amir Shooshtari, Ebrahim Al-Hajri
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 277-283, July 6–8, 2011
Paper No: IPACK2011-52179
DOI: https://doi.org/10.1115/IPACK2011-52179
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Topics: Heat recovery, Heat transfer, Flow (Dynamics), Heat transfer coefficients, Pressure drop, Refrigerants, Thermal management, Absorption, Cooling, Electronic products
Proceedings Papers

Determination and Verification of Silicon Die Strength Using Ball-Breaker Test

Pei-Chi Chen, Shin-Yueh Yang, Kuo-Ning Chiang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 299-305, July 6–8, 2011
Paper No: IPACK2011-52200
DOI: https://doi.org/10.1115/IPACK2011-52200
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Topics: Silicon, Fracture (Materials), Finite element methods, Semiconductor wafers, Computer software, Diluents, Electronic packaging, Failure, Failure mechanisms, Packaging density (Electronics)
Proceedings Papers

Phase Change Metallic Alloy TIM2 Performance and Reliability

Chris G. Macris, Robert G. Ebel, Christopher B. Leyerle, John C. McCullough
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 415-422, July 8–12, 2007
Paper No: IPACK2007-33702
DOI: https://doi.org/10.1115/IPACK2007-33702
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Topics: Alloys, Reliability, Vehicles, Accelerated life testing, Contact resistance, Electrical measurement, Junctions, Metals, Performance characterization, Stress
Proceedings Papers

Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects

Alex Vukovic, Michel Savoie
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1375-1377, July 17–22, 2005
Paper No: IPACK2005-73039
DOI: https://doi.org/10.1115/IPACK2005-73039
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Topics: Density, Heat pipes, Optical interconnections, Performance characterization, Server racks, Thermal management
Proceedings Papers

Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry

Daniel J. Hyman, Roger Kuroda
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2053-2056, July 17–22, 2005
Paper No: IPACK2005-73419
DOI: https://doi.org/10.1115/IPACK2005-73419
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Topics: Flip-chip assemblies, Microelectromechanical systems, Microwaves, Packaging, Flip-chip, Reliability, Filters, Performance characterization, Yield strength