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Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022
Paper No: IPACK2022-97449
https://doi.org/10.1115/IPACK2022-97449
View Paper titled, Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days
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Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials
Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021
Paper No: IPACK2021-74069
https://doi.org/10.1115/IPACK2021-74069
View Paper titled, Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months
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Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages
Proceedings Papers

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020
Paper No: IPACK2020-2659
https://doi.org/10.1115/IPACK2020-2659
View Paper titled, High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging
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Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Paper No: IPACK2017-74169
https://doi.org/10.1115/IPACK2017-74169
View Paper titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
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Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface

Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A008, July 16–18, 2013
Paper No: IPACK2013-73324
https://doi.org/10.1115/IPACK2013-73324
View Paper titled, Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface
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Topics: Hydrogen, Mechanical properties, Silicon crystals, Silicon, Atoms, Boiling, Boron, Deformation, Plasticity, Stress
Proceedings Papers

Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder

Michael Neilsen, Paul Vianco
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A004, July 16–18, 2013
Paper No: IPACK2013-73074
https://doi.org/10.1115/IPACK2013-73074
View Paper titled, Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder
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Topics: Creep, Damage, Plasticity, Solders, Fatigue, Solder joints, Finite element analysis, Fracture (Materials), Package on package, Electronic packaging
Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A020, July 16–18, 2013
Paper No: IPACK2013-73315
https://doi.org/10.1115/IPACK2013-73315
View Paper titled, Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic
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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility
Proceedings Papers

Predicting Crack Growth and Fatigue Lives of QFN Solder Joints Using a Multiscale Fracture Model

Dennis Chan, Dhruv Bhate, Ganesh Subbarayan, Jeff Zhao, Darvin Edwards
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 207-213, July 19–23, 2009
Paper No: InterPACK2009-89403
https://doi.org/10.1115/InterPACK2009-89403
View Paper titled, Predicting Crack Growth and Fatigue Lives of QFN Solder Joints Using a Multiscale Fracture Model
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Topics: Fatigue, Fracture (Materials), Solder joints, Solders, Geometry, Creep, Failure, Finite element model, Plasticity, Probability
Proceedings Papers

A Multiscale Damage Accumulation Theory for Solder Joint Failure

Dhruv Bhate, Kaushik Mysore, Ganesh Subbarayan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 191-197, July 19–23, 2009
Paper No: InterPACK2009-89399
https://doi.org/10.1115/InterPACK2009-89399
View Paper titled, A Multiscale Damage Accumulation Theory for Solder Joint Failure
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Topics: Damage, Failure, Solder joints, Fracture (Materials), Alloys, Energy dissipation, Thermodynamics, Brittleness, Microscopes, Plasticity
Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Paper No: InterPACK2009-89098
https://doi.org/10.1115/InterPACK2009-89098
View Paper titled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints
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Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis
Proceedings Papers

Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys

K. Mysore, S. Chavali, D. Chan, G. Subbarayan, I. Dutta, V. Gupta, D. Edwards
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 443-450, July 19–23, 2009
Paper No: InterPACK2009-89401
https://doi.org/10.1115/InterPACK2009-89401
View Paper titled, Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys
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Topics: Alloys, Flow (Dynamics), Solders, Steady state, Creep, Temperature, Plasticity, Stress, Geometry, Shear (Mechanics)
Proceedings Papers

Electromigration Damage Mechanics of Interconnects

Cemal Basaran, Minghui Lin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 83-94, July 19–23, 2009
Paper No: InterPACK2009-89006
https://doi.org/10.1115/InterPACK2009-89006
View Paper titled, Electromigration Damage Mechanics of Interconnects
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Topics: Damage mechanics, Electrodiffusion, Damage, Nanoelectronics, Boundary-value problems, Current density, Diffusion (Physics), Copper, Materials degradation, Plasticity
Proceedings Papers

Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages

Arun Raman, Jun Tian, Alfred A. La Mar, Shalabh Tandon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1881-1887, July 17–22, 2005
Paper No: IPACK2005-73389
https://doi.org/10.1115/IPACK2005-73389
View Paper titled, Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages
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Topics: Lasers, Spallation (Nuclear physics), Adhesion, Adhesives, Ball-Grid-Array packaging, Copper, Dielectric materials, Epoxy adhesives, Epoxy resins, Flip-chip
Proceedings Papers

A Slim Sector Model for the Analysis of Fatigue Life of Fine Pitch Flip Chip Packages

Bing Zhao, Andrew A. O. Tay
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1529-1534, July 17–22, 2005
Paper No: IPACK2005-73418
https://doi.org/10.1115/IPACK2005-73418
View Paper titled, A Slim Sector Model for the Analysis of Fatigue Life of Fine Pitch Flip Chip Packages
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Topics: Fatigue analysis, Flip-chip packages, Finite element analysis, Creep, Flip-chip devices, Solders, Strips, Boundary-value problems, Computation, Computer technology
Proceedings Papers

Characterization of Non-Conductive Adhesives

Daniel Farley, Abhijit Dasgupta, J. F. J. M. Caers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005
Paper No: IPACK2005-73021
https://doi.org/10.1115/IPACK2005-73021
View Paper titled, Characterization of Non-Conductive Adhesives
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Topics: Adhesives, Manufacturing, Stress, Metals, Modeling, Contact resistance, Simulation, Temperature, Bonding, Compression