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Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Paper No: IPACK2022-97434
DOI: https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
Click here to open pdf in another window PDF for A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model

Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Paper No: IPACK2022-97421
DOI: https://doi.org/10.1115/IPACK2022-97421
View Paper titled, Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
Click here to open pdf in another window PDF for Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
Topics: Cooling, Plates (structures), Thermal resistance, Flow (Dynamics), Pressure drop, Computational fluid dynamics, Coolants, Cooling systems, Engineering simulation, Fluids
Proceedings Papers

Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Paper No: IPACK2022-97425
DOI: https://doi.org/10.1115/IPACK2022-97425
View Paper titled, Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment
Click here to open pdf in another window PDF for Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment
Topics: Cooling, Data centers, Flow control, Plates (structures), Transients (Dynamics)
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Paper No: IPACK2022-97416
DOI: https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
Click here to open pdf in another window PDF for Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
DOI: https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Click here to open pdf in another window PDF for Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

Alec Nordlund, Rachel McAfee, Rebecca Ledsham, Joshua Gess
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021
Paper No: IPACK2021-74108
DOI: https://doi.org/10.1115/IPACK2021-74108
View Paper titled, Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing
Click here to open pdf in another window PDF for Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing
Topics: Additive manufacturing, Cooling, Graphics processing units, Nitrogen, Plates (structures)
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Paper No: IPACK2021-73015
DOI: https://doi.org/10.1115/IPACK2021-73015
View Paper titled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
Click here to open pdf in another window PDF for Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement

Deogratius Kisitu, Alfonso Ortega
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 26–28, 2021
Paper No: IPACK2021-73283
DOI: https://doi.org/10.1115/IPACK2021-73283
View Paper titled, Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement
Click here to open pdf in another window PDF for Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement
Topics: Cooling, Flow (Dynamics), Microchannels, Plates (structures)
Proceedings Papers

Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System

Manasa Sahini, Chinmay Kshirsagar, Patrick McGinn, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 27–30, 2018
Paper No: IPACK2018-8255
DOI: https://doi.org/10.1115/IPACK2018-8255
View Paper titled, Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System
Click here to open pdf in another window PDF for Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System
Topics: Coolants, Cooling, Water, Data centers, Pumps, Stress, Temperature, Energy consumption, Heat exchangers, Exhaust systems
Proceedings Papers

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation

Dogacan Kara, F. Nazli Donmezer Akgun
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 29–September 1, 2017
Paper No: IPACK2017-74125
DOI: https://doi.org/10.1115/IPACK2017-74125
View Paper titled, Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation
Click here to open pdf in another window PDF for Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation
Topics: Gallium nitride, Plates (structures), Collapse, Electrons, Heating, Reliability, Electric fields, Electron mobility, Engineering simulation, Joules
Proceedings Papers

CMUTs in Permanent Contact Operation for High Output Pressure

Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A012, July 6–9, 2015
Paper No: IPACK2015-48733
DOI: https://doi.org/10.1115/IPACK2015-48733
View Paper titled, CMUTs in Permanent Contact Operation for High Output Pressure
Click here to open pdf in another window PDF for CMUTs in Permanent Contact Operation for High Output Pressure
Topics: Pressure, Transducers, Acoustics, Cavities, Ultrasonic transducers, Bonding, Cycles, Deflection, Displacement, High temperature
Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Rick Beyerle, Gary Shives
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Paper No: IPACK2015-48523
DOI: https://doi.org/10.1115/IPACK2015-48523
View Paper titled, Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications
Click here to open pdf in another window PDF for Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications
Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics
Proceedings Papers

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Jiaqi Wang, Jeffery C. C. Lo, S. W. Ricky Lee, Feng Yun, Mian Tao
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A046, July 6–9, 2015
Paper No: IPACK2015-48664
DOI: https://doi.org/10.1115/IPACK2015-48664
View Paper titled, Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
Click here to open pdf in another window PDF for Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
Topics: Absorption, Emissions, Light scattering, Light-emitting diodes, Modeling, Phosphors, Wavelength, Excitation, Emission spectra, Plates (structures)
Proceedings Papers

Thermodynamic Analysis of Full Liquid-Cooled Data Centers

A. Bhalerao, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A028, July 6–9, 2015
Paper No: IPACK2015-48439
DOI: https://doi.org/10.1115/IPACK2015-48439
View Paper titled, Thermodynamic Analysis of Full Liquid-Cooled Data Centers
Click here to open pdf in another window PDF for Thermodynamic Analysis of Full Liquid-Cooled Data Centers
Topics: Data centers, Heat, Plates (structures), Cooling, Exergy, Computers, Cooling towers, Modeling, Systems analysis
Proceedings Papers

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A013, July 6–9, 2015
Paper No: IPACK2015-48152
DOI: https://doi.org/10.1115/IPACK2015-48152
View Paper titled, Understanding the True Total Cost of Ownership of Water Cooling for Data Centers
Click here to open pdf in another window PDF for Understanding the True Total Cost of Ownership of Water Cooling for Data Centers
Topics: Cooling, Data centers, Water, Construction, Density, Doors, Energy dissipation, Heat, Heat exchangers, Innovation
Proceedings Papers

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

Suchismita Sarangi, Will A. Kuhn, Scott Rider, Claude Wright, Shankar Krishnan
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A046, July 6–9, 2015
Paper No: IPACK2015-48640
DOI: https://doi.org/10.1115/IPACK2015-48640
View Paper titled, Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters
Click here to open pdf in another window PDF for Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters
Topics: Cooling, Fluids, Temperature, Boiling, Bose-Einstein condensates, Air flow, Coating processes, Coatings, Coolants, Engineering standards
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Paper No: IPACK2013-73264
DOI: https://doi.org/10.1115/IPACK2013-73264
View Paper titled, Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors
Click here to open pdf in another window PDF for Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors
Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013
Paper No: IPACK2013-73028
DOI: https://doi.org/10.1115/IPACK2013-73028
View Paper titled, Applications of Cold Plate Units With Micro-Channel for Cooling Electronics
Click here to open pdf in another window PDF for Applications of Cold Plate Units With Micro-Channel for Cooling Electronics
Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design
Proceedings Papers

Novel Immersion Cooling Technique for a 3D Chip Stack

Ashish Sinha, Krishna Kota, Pablo Hidalgo, Yogendra Joshi, Ari Glezer
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A004, July 16–18, 2013
Paper No: IPACK2013-73039
DOI: https://doi.org/10.1115/IPACK2013-73039
View Paper titled, Novel Immersion Cooling Technique for a 3D Chip Stack
Click here to open pdf in another window PDF for Novel Immersion Cooling Technique for a 3D Chip Stack
Topics: Cooling, Fluids, Electronics, Heat, Copper, Water, Convection, Energy dissipation, Heat conduction, Heat sinks
Proceedings Papers

Development of a Compliant Nanothermal Interface Material

David Shaddock, Stanton Weaver, Ioannis Chasiotis, Binoy Shah, Dalong Zhong
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 13-17, July 6–8, 2011
Paper No: IPACK2011-52015
DOI: https://doi.org/10.1115/IPACK2011-52015
View Paper titled, Development of a Compliant Nanothermal Interface Material
Click here to open pdf in another window PDF for Development of a Compliant Nanothermal Interface Material
Topics: Copper, Fatigue, Manufacturing, Plates (structures), Power density, Silicon, Solders, Stress, Testing performance, Thermal conductivity