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Proceedings Papers

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A009, July 6–9, 2015
Paper No: IPACK2015-48259
DOI: https://doi.org/10.1115/IPACK2015-48259
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Topics: Gallium nitride, Interfacial thermal resistance, Stress, Polishing equipment, Electronics, Crystal structure, Electron mobility, Flow (Dynamics), Heat, Reliability
Proceedings Papers

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A023, July 16–18, 2013
Paper No: IPACK2013-73276
DOI: https://doi.org/10.1115/IPACK2013-73276
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Topics: Microchannels, Thermal management, Thermoelectric cooling, Cooling, Thermoelectric coolers, Heat, Computer simulation, Currents, Design, Electric current
Proceedings Papers

Impact of Material Properties on Cooling COP of Integrated Thermoelectric Microcoolers

Yee Rui Koh, Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A036, July 16–18, 2013
Paper No: IPACK2013-73184
DOI: https://doi.org/10.1115/IPACK2013-73184
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Topics: Cooling, Materials properties, Microcoolers, Thermal conductivity, Compression, Cycles, Electrical conductivity, Energy consumption, Energy efficiency, Heat
Proceedings Papers

Role of Interface Thermal Boundary Resistance, Straining, and Morphology in Thermal Conductivity of a Set of Si-Ge Superlattices and Biomimetic Si-Ge Nanocomposites

Vikas Samvedi, Vikas Tomar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 361-367, July 6–8, 2011
Paper No: IPACK2011-52284
DOI: https://doi.org/10.1115/IPACK2011-52284
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Topics: Biomimetics, Interfacial thermal resistance, Nanocomposites, Superlattices, Thermal conductivity, Nanoscale phenomena, Nanostructures , Temperature, Engineering simulation, Equilibrium (Physics)
Proceedings Papers

Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties

T. D. Musho, D. G. Walker
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 171-175, July 19–23, 2009
Paper No: InterPACK2009-89332
DOI: https://doi.org/10.1115/InterPACK2009-89332
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Topics: Composite materials, Simulation, Alloys, Bulk solids, Density, Design, Electromagnetic scattering, Nanoscale phenomena, Phonons, Radiation scattering
Proceedings Papers

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics

Ihtesham Chowdhury, Ravi Prasher, Kelly Lofgreen, Sridhar Narasimhan, Ravi Mahajan, David Koester, Rama Venkatasubramanian
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 521-526, July 19–23, 2009
Paper No: InterPACK2009-89268
DOI: https://doi.org/10.1115/InterPACK2009-89268
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Topics: Cooling, Heat flux, Superlattices, Thin films, Thermoelectric coolers, Thermal management, Electronic packages, Electronics, Lasers, Microscale devices
Proceedings Papers

Effect of Phonon Dispersion on Thermal Conduction Across Si/Ge Interfaces

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 575-591, July 19–23, 2009
Paper No: InterPACK2009-89208
DOI: https://doi.org/10.1115/InterPACK2009-89208
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Topics: Heat conduction, Phonons, Superlattices, Engineering simulation, Simulation, Thermal conductivity, Acoustics, Electromagnetic scattering, Equilibrium (Physics), Germanium
Proceedings Papers

Superlattice Thermoelectrics for Thermal Management of Electronics and Optoelectronics

R. Venkatasubramanian, B. O’Quinn, R. Alley, E. Siivola, A. Reddy, M. Soto, P. Addepalli
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2147-2152, July 17–22, 2005
Paper No: IPACK2005-73198
DOI: https://doi.org/10.1115/IPACK2005-73198
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Topics: Electronics, Optoelectronic devices, Superlattices, Thermal management, Reliability, Cooling, Refrigeration, Thin films
Proceedings Papers

Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects

A. Bulusu, D. G. Walker
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1427-1432, July 17–22, 2005
Paper No: IPACK2005-73212
DOI: https://doi.org/10.1115/IPACK2005-73212
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Topics: Electromagnetic scattering, Electron transport, Modeling, Radiation scattering, Scattering (Physics), Thin films, Equilibrium (Physics), Phonons, Dimensions, Electrons
Proceedings Papers

Experimental Characterization of Bonded Microcoolers for Hot Spot Removal

Yan Zhang, Gehong Zeng, Christine Hoffman, Ali Shakouri, Peng Wang, Avram Bar-Cohen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2189-2197, July 17–22, 2005
Paper No: IPACK2005-73466
DOI: https://doi.org/10.1115/IPACK2005-73466
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Topics: Experimental characterization, Microcoolers, Cooling, Coolers, Flow (Dynamics), Heat, Heat flux, Integrated circuits, Microelectronic devices, Power density