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Solid State Power Generation and Refrigeration for Electronic Packages and Systems
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Proceedings Papers

Sizing of Pellets in Thermoelectric Modules (TEMs)

Marc Hodes
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2123-2131, July 17–22, 2005
Paper No: IPACK2005-73074
https://doi.org/10.1115/IPACK2005-73074
View Paper titled, Sizing of Pellets in Thermoelectric Modules (TEMs)
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Topics: Contact resistance, Electrical resistance, Energy consumption, Geometry, Heat, Heat flux, Refrigeration, Stress
Proceedings Papers

Quantum Well Thermoelectric Devices

S. Ghamaty, N. B. Elsner
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2133-2138, July 17–22, 2005
Paper No: IPACK2005-73173
https://doi.org/10.1115/IPACK2005-73173
View Paper titled, Quantum Well Thermoelectric Devices
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Topics: Quantum wells, Thermoelectric devices
Proceedings Papers

An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment

Robert A. Taylor, Gary L. Solbrekken
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2139-2145, July 17–22, 2005
Paper No: IPACK2005-73190
https://doi.org/10.1115/IPACK2005-73190
View Paper titled, An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment
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Topics: Electronic equipment, Optimization, Refrigeration, Heat sinks, Temperature, Junctions, Cooling, Geometry, Electronics, Heat
Proceedings Papers

Superlattice Thermoelectrics for Thermal Management of Electronics and Optoelectronics

R. Venkatasubramanian, B. O’Quinn, R. Alley, E. Siivola, A. Reddy, M. Soto, P. Addepalli
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2147-2152, July 17–22, 2005
Paper No: IPACK2005-73198
https://doi.org/10.1115/IPACK2005-73198
View Paper titled, Superlattice Thermoelectrics for Thermal Management of Electronics and Optoelectronics
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Topics: Electronics, Optoelectronic devices, Superlattices, Thermal management, Reliability, Cooling, Refrigeration, Thin films
Proceedings Papers

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Ioan Sauciuc, Hakan Erturk, Gregory Chrysler, Vikram Bala, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2153-2159, July 17–22, 2005
Paper No: IPACK2005-73243
https://doi.org/10.1115/IPACK2005-73243
View Paper titled, Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling
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Topics: Compressors, Computation, Computational fluid dynamics, Computer cooling, Control equipment, Cooling, Cycles, Energy consumption, Fluids, Geometry
Proceedings Papers

Thermoelectric Micro-Cooler for Hot-Spot Thermal Management

Peng Wang, Avram Bar-Cohen, Bao Yang, Gary L. Solbrekken, Yan Zhang, Ali Shakouri
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2161-2171, July 17–22, 2005
Paper No: IPACK2005-73244
https://doi.org/10.1115/IPACK2005-73244
View Paper titled, Thermoelectric Micro-Cooler for Hot-Spot Thermal Management
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Topics: Cooling, Microcoolers, Thermal management
Proceedings Papers

Thermal Simulation and Experimental Validation for TEC Design

Peter Shi, Stephen Wong, Yeow Meng Tan, Vasudivan Sunappan, Wei Fan, Kai Meng Chua, Bill Freeman, Hongjin Jiang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2173-2178, July 17–22, 2005
Paper No: IPACK2005-73309
https://doi.org/10.1115/IPACK2005-73309
View Paper titled, Thermal Simulation and Experimental Validation for TEC Design
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Topics: Design, Simulation, Thermoelectric coolers
Proceedings Papers

Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications

Kazuhiko Fukutani, Ali Shakouri
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2179-2183, July 17–22, 2005
Paper No: IPACK2005-73410
https://doi.org/10.1115/IPACK2005-73410
View Paper titled, Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications
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Topics: Cooling, Optimization, Thermal resistance, Energy dissipation, Power density, Circuits, Coolers, Geometry, Heat, Integrated circuits
Proceedings Papers

Multi-Layer Thermionic-Tunneling Structures for Power Generation

Taofang Zeng
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2185-2187, July 17–22, 2005
Paper No: IPACK2005-73448
https://doi.org/10.1115/IPACK2005-73448
View Paper titled, Multi-Layer Thermionic-Tunneling Structures for Power Generation
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Topics: Energy generation, Tunnel construction, Heat, Heat transfer, Design, Electrodes, Electron transport, Electrons, Generators, Heat sinks
Proceedings Papers

Experimental Characterization of Bonded Microcoolers for Hot Spot Removal

Yan Zhang, Gehong Zeng, Christine Hoffman, Ali Shakouri, Peng Wang, Avram Bar-Cohen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2189-2197, July 17–22, 2005
Paper No: IPACK2005-73466
https://doi.org/10.1115/IPACK2005-73466
View Paper titled, Experimental Characterization of Bonded Microcoolers for Hot Spot Removal
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Topics: Experimental characterization, Microcoolers, Cooling, Coolers, Flow (Dynamics), Heat, Heat flux, Integrated circuits, Microelectronic devices, Power density
Proceedings Papers

Peltier Enhanced Heat Spreading for Localized Hot Spot Thermal Management

Gary L. Solbrekken
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2199-2205, July 17–22, 2005
Paper No: IPACK2005-73471
https://doi.org/10.1115/IPACK2005-73471
View Paper titled, Peltier Enhanced Heat Spreading for Localized Hot Spot Thermal Management
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Topics: Heat, Thermal management, Heat flux, Thermal conductivity, Thermoelectricity, Electrical resistivity, Heating, Junctions, Temperature, Temperature gradient
Proceedings Papers

Monte Carlo Simulation of the Thermal Conductivity and Phonon Transport in Nanocomposites

Ming-Shan Jeng, Ronggui Yang, David Song, Gang Chen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2207-2215, July 17–22, 2005
Paper No: IPACK2005-73494
https://doi.org/10.1115/IPACK2005-73494
View Paper titled, Monte Carlo Simulation of the Thermal Conductivity and Phonon Transport in Nanocomposites
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Topics: Nanocomposites, Phonons, Simulation, Thermal conductivity
Proceedings Papers

Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings

R. McCarty, K. P. Hallinan, B. Sanders, T. Somphone
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2109-2122, July 17–22, 2005
Paper No: IPACK2005-73010
https://doi.org/10.1115/IPACK2005-73010
View Paper titled, Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings
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Topics: Energy recovery, Heat, Temperature, Thermoelectric devices, Aerospace industry, Computer simulation, Exergy, Heat recovery, Switches, Waste heat