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Keywords: 3DPC
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, October 7–9, 2019
Paper No: IPACK2019-6616
... Science and Engineering, Huazhong University of Science and Technology Wuhan, China ABSTRACT Fabrication of three-dimensional cavities containing kaolin pastes to be used as direct plated copper (3DPC) substrates ceramics is a very important advancement for electronic packaging of hermetic and ultraviolet...