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Keywords: CPU temperature
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 27–29, 2020
Paper No: IPACK2020-2662
.... The chosen heatsink geometries were: Parallel plate, Pin fin, and Plate fin heatsinks. 1 Contact author: amirezza.nizamand@mavs.uta.edu Keywords: Open commute server, thermal conductivity, specific heat, mass concentration, immersion cooling, CPU temperature, pressure drop, pumping power NOMENCLATURE h heat...