1-2 of 2
Keywords: QSAC-20
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112036
... the constitutive model. solder joint leadfree high strain rate low temperature material properties QSAC-10 QSAC-20 aging properties Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97449
... solder joint leadfree high strain rate low temperature material properties QSAC-10 QSAC-20 aging properties Abstract In aerospace, military, and automotive applications, various electronic parts may be subjected to sustained operation at high and low surrounding temperatures...