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Keywords: Taguchi Method
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Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 581-590, July 8–12, 2007
Paper No: IPACK2007-33597
... not comply with the global deformation are realized. Both the upper and lower pad radii have an opposite effect on the fatigue life of the solders. The fatigue life of the solders decreases as the thickness of the substrate or the PC board increases. The results using the Taguchi method reveal that among...