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Keywords: ball grid array (BGA)
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
... of thermomechanical reliability, second level underfilling should be individually specified for varied packages. ball grid array (BGA) underfill digital image correlation (DIC) Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-66660
... layer substrate with low-loss dielectric of ABF-GL102 is used for the study. We scan the gap size of via pad which contributes the impedance discontinuity thus impacts signal integrity. Die bump and BGA pin assignments are the other two key factors in cause of crosstalk. ball grid array (BGA...