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Keywords: data center
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112005
... a system and enables higher equipment reliability. Thermal management of data center electronics is becoming more challenging due to rising power densities at the chip level. Cooling technologies like single-phase immersion cooling allow overcoming many such challenges owing to their higher thermal mass...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111743
... was estimated to be about 0.04°C/W, with further opportunities for improvement. Keywords: immersion cooling, two-phase heat transfer, data center, dielectric fluids, energy efficiency NOMENCLATURE ABP Effective area of the boiler plate Df Dissipation factor Dk Dielectric constant RTH RHS RGPU Total thermal...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112019
... Abstract This paper proposes a computational fluid dynamics (CFD) simulation methodology for the multi-design variable optimization of heat sinks for natural convection single-phase immersion cooling of high power-density Data Center server electronics. Immersion cooling provides the capability...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110576
... into the impact of coolant selection at the data center level. There is limited research available on the reliability used in direct-to-chip liquid cooling, and there is currently no standardized methodology for testing their reliability. This study aims to fill this gap by focusing on the reliability of coolants...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111307
... an attractive and efficient solution while transitioning from traditional air cooling inside the data center. Using a thermal test vehicle (TTV) can be a cost-effective and reliable methodology to commission liquid-cooled components successfully without risking actual IT equipment. TTVs can also be highly...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111848
... is accuracy comparable to the best two-phase pressure drop correlations in the literature, so a good validation result. For the temperature validation, 98% of the datapoints were within ±5 °C of the experimental measurements, highlighting the robustness of the solver. edge computing data center...
Topics: Cooling systems
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
... and each CPU can support up to 12 DIMM channels. Therefore, in a data center where high-power dense compute systems are packed together, it demands efficient cooling for the overall server components. In single-phase immersion cooling technology, electronic components or servers are typically submerged...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
... temperature and the TTV case temperatures at 10%, 50%, and 100% of the total delivered power. Finally, suggestions for the best control fan scheme to use for these systems and units are provided at the conclusion of the study. data center high heat density rack liquid cooling liquid-to-air heat...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111564
... and benchmarked against their ranges for human comfort as listed in ASHREE standards. At the end of this research, recommendations for best practice are provided along with areas of enhancement for the selected system. electronic thermal management data center liquid-to-air CDU rack level cooling...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114351
.... Furthermore, 1D flow network and CFD models of the rack-level coolant loop, including the rack manifold, were developed, and validated against experimental test data. The validated models provide a useful tool for the design of facility-level modeling of a liquid-cooled data center. The CFD models enable...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111959
... we developed a comparative analysis for four different cooling methods for a 1.7MW data center to indicate how the type and scale of the cooling technology impacts the total efficiency and costs. IT load is kept constant among all the four studies and only the cooling infrastructure configuration has...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97429
... Abstract Submerging a cluster of servers inside a large tank is the customary way of employing single-phase immersion cooling. But this approach requires a complete renovation of existing air-cooled infrastructure. A practical approach to convert an air-cooled data center to immersion cooled...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
... technologies since the 1980s. Major data and cloud providers are actively deploying liquid-cooled data center infrastructure due to rising computational demands. Liquid to liquid heat exchangers used in liquid-cooled data centers is also referred to as coolant distribution units (CDUs). Most of these CDUs...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97443
.... data center liquid cooling transient analysis hydraulics Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25-27, 2022, Garden Grove, California IPACK2022-97443 TRANSIENT CFD...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97047
.... Therefore, it is necessary to look for an alternative green refrigerant that can be adopted in the system without significantly impacting its performance. Preliminary results showed that R1234yf is the most appropriate replacement for R134a in two-phase rack-level cooling systems. data center two...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97478
... Abstract Thermal predictions in data centers have been utilized to reduce the electric consumption of thermal equipment in data centers. While most of the optimization of data center temperature has been performed through the utilization of Computational Fluid Dynamics (CFD) and heuristic...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2592
... servers in each of them. The high amount of heat dissipation has become the largest server-level cooling problem for the data centers. The higher dissipation required, the higher is the total energy required to run the data center. Although still the most widely used cooling methodology, air cooling has...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
... for the challenges of on substrate process and reliability, meanwhile simulation is performed for stress prediction. In addition, possible solutions from material and process are discussed and studied. HPC data center cloud computing chip module UF encapsulation reliability HIGH PERFORMANCE COMPUTING...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2590
... Abstract Modern-day data center administrators are finding it increasingly difficult to lower the costs incurred in mechanical cooling of their IT equipment. This is especially true for high-performance computing facilities like Artificial Intelligence, Bitcoin Mining, and Deep Learning, etc...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6304
... Abstract Efficient cooling of data center infrastructure is an important way to reduce total energy consumption. Containment, with separation of hot and cold airflows has allowed significant increase in efficiencies. However, balancing the airflow, so that IT equipment in an aisle only receives...