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Keywords: deformation of the die
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Proceedings Papers
Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97218
... estimated the pick-up performance of the Bernoulli picker and the deformation of the die using pseudo-coupling of flow and structural analysis. We simulated the flow field around the target die and picker using the RANS equation with the k-w SST turbulence model to predict the levitation height between...
