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Keywords: digital image correlation (DIC)
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
... and full bottom surface bonding) and no-underfill were studied. To quantitatively measure the deformation of solder balls, all the BGA packages were cross-sectioned before thermal cycles. The two-dimensional digital image correlation (DIC) technique was used to capture the in-plane deformation...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73291
... response of the glass. Excellent correlation in deflection is obtained between the measurements and predictions. Glass Impact test Digital Image Correlation (DIC) Finite element analysis (FEA) Energy level Momentum change DYNAMIC ANALYSIS OF THIN GLASS UNDER BALL DROP IMPACT WITH NEW METRICS...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73292
... improve the dynamic fracture criterion of glass. For the experimental studies, the Digital Image Correlation (DIC) method enables one to obtain the first principal strain of the glass during the impact process. Moreover, the FEA model is developed in ANSYS/LS-DYNA™. Dynamic fracture Glass Digital...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73293
.... In addition, the FEA model of edge impact test is developed in ANSYS/LS-DYNA™. Thin glass Edge impact Digital Image Correlation (DIC) Ball drop impact AN EXPERIMENTAL AND NUMERICAL STUDY OF THE BEHAVIOR OF THE THIN GLASS EDGE UNDER BALL DROP IMPACT Liang Xue Binghamton University Binghamton, NY...
Topics: Glass