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Keywords: fatigue life
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Paper No: IPACK2019-6584
...- levels needed to assure reliability of flexible electronics. There is need for studies focused on the development of accelerated test conditions representative of field applications and the identification of failure mechanisms for test levels. In this study, experimental analysis on fatigue life...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Paper No: IPACK2019-6561
... from -40 to 125 oC. Separate simulations were also performed using temperature dependent elastic properties for the underfill material. In both cases, the solder joint fatigue life was estimated, and the effects of using viscoelastic properties for the underfill in solder joint fatigue life simulation...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 581-590, July 8–12, 2007
Paper No: IPACK2007-33597
... 12 01 2010 This paper presents a study of the effects of selected geometry features on the fatigue life of the Sn3.5Ag lead-free solder ball on a multi-chip module (MCM) package. The features considered are both the upper and lower solder pad radii, the thickness of the substrate...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1827-1832, July 17–22, 2005
Paper No: IPACK2005-73165
... for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical wave profile, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not so superior under asymmetrical wave condition. The fatigue crack was developed from...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1095-1100, July 17–22, 2005
Paper No: IPACK2005-73058
... Intergrain stresses Fatigue life PBGA CBGA Cross polarized microscopy Proceedings of IPACK2005 ASME InterPACK 05 technology. Bu eutectic Pb-Sn SnAgCu (SAC) failure mechani construction of models. Near eutectic Sn observed to con to generally mu PbSn solder jo Cu6Sn5 and Ag3 The size of the and reflow...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 155-160, July 6–11, 2003
Paper No: IPACK2003-35165
... results in preventing a shear plastic deformation of solder bump. Therefore, the flip chip joints made using higher silver content solder such as 3 and 4Ag exhibit longer fatigue life, if the same levels of displacement is applied. The fatigue ductility of the solder decreases with increasing the silver...