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1-7 of 7
Keywords: fatigue life
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Paper No: IPACK2022-97253
... Abstract Estimation of the thermal fatigue life of solder joints and identification of parameters that enhance the fatigue life are important steps in the development stage of BGA packages. In this study, different parameters of Sn-Ag-Cu 305 BGA (Ball Grid Array) solder balls are investigated...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Paper No: IPACK2019-6584
... focused on the development of accelerated test conditions representative of field applications and the identification of failure mechanisms for test levels. In this study, experimental analysis on fatigue life of the PCB in cyclical folding load is conducted. A folding test-stand capable of replicating...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Paper No: IPACK2019-6561
... performed using temperature dependent elastic properties for the underfill material. In both cases, the solder joint fatigue life was estimated, and the effects of using viscoelastic properties for the underfill in solder joint fatigue life simulation were investigated. FEA underfill fatigue life...
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 581-590, July 8–12, 2007
Paper No: IPACK2007-33597
... 12 01 2010 This paper presents a study of the effects of selected geometry features on the fatigue life of the Sn3.5Ag lead-free solder ball on a multi-chip module (MCM) package. The features considered are both the upper and lower solder pad radii, the thickness of the substrate...
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1827-1832, July 17–22, 2005
Paper No: IPACK2005-73165
... solder alloys. The fatigue lives of micro-bulk solder beyed Manson-Coffin s empirical law, and the fatigue uctility exponents were about 0.55 for both Sn-Ag-Cu and Sn- b alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 mes longer than that of Sn-37Pb alloy under symmetrical ave profile, although...
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1095-1100, July 17–22, 2005
Paper No: IPACK2005-73058
... Intergrain stresses Fatigue life PBGA CBGA Cross polarized microscopy Proceedings of IPACK2005 ASME InterPACK 05 technology. Bu eutectic Pb-Sn SnAgCu (SAC) failure mechani construction of models. Near eutectic Sn observed to con to generally mu PbSn solder jo Cu6Sn5 and Ag3 The size of the and reflow...
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 155-160, July 6–11, 2003
Paper No: IPACK2003-35165
.... Therefore, the flip hip joints made using higher silver content solder such as 3 nd 4Ag exhibit longer fatigue life, if the same levels of isplacement is applied. The fatigue ductility of the solder ecreases with increasing the silver content. Therefore, the tigue endurance of the 1Ag solder itself...
