... Abstract Traditional air-cooling along with corresponding heat sinks are beginning to reach performance limits, requiring lower air-supply temperatures and higher air-supply flowrates, in order to meet the rising thermal management requirements of high power-density electronics. A switch from...

... Abstract This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of additively manufactured topology-based...

... specifically, SiC/Si-IGBT hybrid inverter systems requiring enhanced cooling. Experimental test for this heat sink device consists of flow loop tests through conventional hot plates with a first-generation heat sink device attached. This heat spreading device consists of an internal manifold design...

... Abstract This article conceptualizes a single-phase microchannel heat sink for thermal management of concentrated photovoltaic cells; details of the model-based parametric study that is carried out on the heat sink is also detailed in this article. The heat sink consists of multiple serpentine...

... Abstract This work presents a simplified approach to optimally designing a heat sink with metallic thermal conductivity enhancers infiltrated with phase change material for electronic cooling. In present study, thermal conductivity enhancers are in the form of a honeycomb structure...

... production of complex heat transfer devices previously impossible to traditionally manufacture. This paper introduces three novel prototypes, originally designed for a prior ASME Student Heat Sink Design Competition sponsored by the K-16 (Heat Transfer in Electronic Devices) technical committee...

... (60W, 75W and 100W) without resorting to Compact Fluorescent (CFL) bulbs containing mercury while maintaining the standard industry bulb size and shape referred to as A19. For many bulb designs, this A19 size and shape restriction forces a small heat sink which is barely capable of dissipating heat...

... durations is evaluated via numerical simulations. The system performance is optimized with heat sink/fan structure for device efficient operation under constant powering. The study provides meaningful understanding and prediction of a transient powering scenario at high powering levels, evaluating...

... and developed, focusing on natural air heat convection from heat sink to ambient and heat conduction from board to heat sink. Based on thermal analysis associated with mechanical consideration, one heat sink is used to cool multiple components on the board. Two TIMs (thermal interface materials) and one heat...

... flux capability will not be as high, but the cost will be much lower. Key Words: microprocessor cooling, heat sink, fan, blower, ir cooling, cold plate, liquid cooling OMENCLATURE Cp heat capacity, J/kg-K h fin height, m L length (heatsink or cold plate), m COOLING LIMITS q heat flow rate, W The heat...

... 03 04 2009 There is growing interest in the use of polymer composites with enhanced thermal conductivity for high performance fin arrays and heat sinks. However, the thermal conductivity of these materials is relatively low compared to conventional fin metals, and strongly orthotropic...

... 03 04 2009 A simplified theoretical model predicting the heat transfer performance of a heat sink base embedded with a flat heat pipe is developed. Numerical analysis was performed using the commercial software FLUENT. The investigation indicates that for heat sink bases embedded...

..., the development of a LED-based spot module heat sink in a free convective cooling system is discussed. The rationale for choosing a cylindrical tube, longitudinal fin (CTLF) heat sink is shown, as is the performance of five different configurations of the heat sink in various orientations. The requirement...

... An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performances such as local temperature distributions and isotherms on heat spreader surfaces...

... In this work, some simple air-cooled high-effectiveness heat sinks are proposed for the cooling of electronic devices such as microprocessors for personal computers. The performance of the heat sinks are experimentally investigated. In particular the temperature of the heat sink surface...

... Feasibility study on alternative cooling methods to air-cooling with heat sinks is provided in this paper. The study focuses on cooling of 64-bit microprocessor at 80nm technology node with projected heat dissipation of 200W. An example was presented to illustrate limitation of air-cooling...