... of our design. The measured results indicate that the present numerical approach can be utilized for further optimization. Bernoulli picker non-contact die handling hybrid bonding deformation of the die position recovering capability Proceedings of the ASME 2022 International Technical...

... Abstract Hybrid bonding has been explored for more than a decade and implemented recently in high volume production at wafer-to-wafer level for image sensor applications to enable high performance chip-stacking architectures with ultra-high-density chip-to-chip interconnect. The feasibility...

... direct bonding followed by through silicon via (TSV) and hybrid bonding technologies have recently been implemented in the image sensor industry. The preferences and challenges of these two interconnect technologies for image sensor chip stacking are discussed. As TSV technology is relatively mature...