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Keywords: interfacial fracture toughness
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Proceedings Papers

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Paper No: IPACK2022-97427
https://doi.org/10.1115/IPACK2022-97427
.... isothermal exposure thermal aging cohesive zone modeling interfacial fracture toughness delamination epoxy/PCB interface delamination potting compounds Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
View Paper titled, Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
Open the PDF for Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure in another window
Topics: Delamination, Epoxy adhesives, Epoxy resins, High temperature, Modeling
Proceedings Papers

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
https://doi.org/10.1115/IPACK2022-97424
.... Paris power law has been used to establish the relationship between the crack growth rate and the range of stress intensity factors. Paris exponents (A,n) are determined from the relationship to understand the evolution in interfacial fracture toughness with respect number of days of aging under fatigue...
View Paper titled, Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Open the PDF for Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures in another window
Topics: Delamination, Fatigue, Fracture toughness, Temperature
Proceedings Papers

Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination

Jiantao Zheng, Suresh K. Sitaraman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1669-1677, July 17–22, 2005
Paper No: IPACK2005-73495
https://doi.org/10.1115/IPACK2005-73495
... Interfacial Fracture Toughness Thin Film Delamination Mode Mixity Micro-Scale Nano-Scale Proceedings of InterPACK 05: IC exe curr pro met can frac film 100 KE Mo INT with cou duri prop applications to help improve the adhesion of otherwise weakly 1 Copyright © 2005 by ASME fabrication...
View Paper titled, Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination
Open the PDF for Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination in another window
Topics: Delamination, Fracture toughness, Microscale devices, Nanoscale phenomena, Strips, Thin films