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Proceedings Papers

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Paper No: IPACK2022-97427
https://doi.org/10.1115/IPACK2022-97427
.... isothermal exposure thermal aging cohesive zone modeling interfacial fracture toughness delamination epoxy/PCB interface delamination potting compounds Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
View Paper titled, Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
Open the PDF for Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure in another window
Topics: Delamination, Epoxy adhesives, Epoxy resins, High temperature, Modeling
Proceedings Papers

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
https://doi.org/10.1115/IPACK2022-97424
... loading. isothermal exposure FCBGA thermal aging interfacial fracture toughness delamination chip/underfill Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25-27, 2022...
View Paper titled, Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Open the PDF for Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures in another window
Topics: Delamination, Fatigue, Fracture toughness, Temperature