... Abstract The rising demand for high-performance central and graphical processing units has resulted in the need for more efficient thermal management techniques like direct-to-chip liquid cooling. Direct Liquid Cooling using cold plates is one of the most efficient and investigated cooling...

... Abstract Direct to chip liquid-cooling technique has been widely implemented for the cooling of processors with high thermal design power. To further enhance the efficiency of liquid cooling, ongoing research focuses on the optimizations at the cold plate level or by changing the flow...

... Abstract Cold plates are at the heart of pumped liquid cooling systems. In this paper, we report on combined experimental, analytical, and computational efforts to characterize and model the thermal performance of advanced cold plates in order to establish their performance limits. A novel...

... Abstract Due to continuous growth of AI accelerator chip power and heat flux, implementation of advanced cooling technologies for AI platforms seems to be inevitable for hyper scale users. Liquid cooling is one of the relatively more mature category of advanced cooling technologies, and has...

... Abstract This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of additively manufactured topology-based...

... Abstract Increasing demands for cloud-based computing and storage, Internet-of-Things, and machine learning-based applications have necessitated the utilization of more efficient cooling technologies. Direct-to-chip liquid cooling using cold plates has proven to be one of the most efficient...

... Abstract Rising power densities at the server level due to increasing performance demands are being met by using efficient thermal management methods such as direct-to-chip liquid cooling. The use of cold plates that are directly installed yields a lower thermal resistance path from the chip...

.... A gradual transition from 100% air cooling to 25%–75% air and liquid cooling has been studied to capture the changes in IT, fan, facility, and the total data center power consumption. Various system design optimizations such as supply air temperature (SAT), facility chiller water temperature, economization...

... Abstract Impingement split flow liquid-cooled microchannel cold plates are one of several flow configurations used for single-phase liquid cooling. Split flow or top-in/side-exit (TISE) cold plates divide the flow into two branches thus resulting in halved or reduced flow rates and flow lengths...

... removal from LEDs with direct liquid cooling, the current paper starts with explaining the increasing thermal problems in electronics and also in lighting technologies followed by a brief overview of the state of the art for liquid cooling technologies. Then, attention will be turned into thermal...

... The objective of the study is to improve on performance of the current liquid cooling solution for a Multi-Chip Module (MCM) through design of a chip-scale cold plate with quick and accurate thermal analysis. This can be achieved through application of Flow Network Modeling (FNM...

...Proceedings of IPACK2009 ASME InterPACK 09 July 19-23, 2009, San Francisco, CA, USA Copyright @ 2009 by ASME 1 IPACK2009-89144 APPLICATION OF MICRO-CHANNEL FIN FOR COLD PLATE OF LIQUID COOLING SYSTEM AND VAPOR CHAMBER Koichi Mashiko, Masataka Mochizuki, Yuji Saito, Yasuhiro Horiuchi, Thang Nguyen...

... Proceedings of IPACK2005 ASME InterPACK '05 K m dr In Th pa co ac m ev de co 1m he is Proceedings of IPACK2005 ASME InterPACK '05 July 17-22, San Francisco, California, USA1 eywords: liquid cooling, enhancement structure, icrochannels, metallic foam, thermal resistance, pressure op. troduction e...

... 03 04 2009 Proceedings of IPACK2005 International Electronic Packaging Technical Conference and Exhibition p a p s in s a N late using heatsink manufacturing techniques. Case studies re presented to show liquid-cooling with these lower cost cold lates can provide performance that exceeds...

... quality was 100%. The thermal solution demonstrated good repeatability during a limited cycle test. Contact force of approximately 10 lb f (45 N) was found to minimize the thermal resistance of the solution, and no significant improvement is realized beyond that force level. liquid cooling spray...

... telecom servers. It is shown that the principles of energy conversion can be used to overcome the problems of thermal resistance narrowing. Cooling schemes such as mesoscale vapor compression refrigeration, liquid cooling, thermoelectric microcooler and microchannel heat sink are discussed and compared...

... diode arrays and high power electronic components such as CPUs. porous metal liquid cooling high heat flux electronics cooling Proceedings of InterPACK03: International Electronic Packaging Technical Conference and Exhibition INTRODU Semic developed watts. Sin cm long a major con W/cm2...

... for the 200W microprocessor using an all-Cu heat sink with tall fins. Three alternatives to air-cooling were studied in this work: liquid cooling, two-phase convective flow cooling and refrigeration cooling. Thermodynamic analysis was used to estimate operating conditions and fluid flow rates for each...