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Keywords: non-contact die handling
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Proceedings Papers
Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97218
... Abstract This paper focuses on numerical computation and experimental examination of Bernoulli picker, which is the essential module for the 3D stacking process for heterogeneous integration devices, to reveal the fundamental physics of non-contact die handling and to seek optimized design. We...
