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Keywords: position recovering capability
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Proceedings Papers
Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97218
... of our design. The measured results indicate that the present numerical approach can be utilized for further optimization. Bernoulli picker non-contact die handling hybrid bonding deformation of the die position recovering capability Proceedings of the ASME 2022 International Technical...