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Keywords: potting compounds
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Proceedings Papers

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Paper No: IPACK2022-97427
https://doi.org/10.1115/IPACK2022-97427
.... isothermal exposure thermal aging cohesive zone modeling interfacial fracture toughness delamination epoxy/PCB interface delamination potting compounds Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
View Paper titled, Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
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Topics: Delamination, Epoxy adhesives, Epoxy resins, High temperature, Modeling