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Keywords: pumping power
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 26–28, 2021
Paper No: IPACK2021-74010
... conceptualizes a single-phase microchannel serpentine microchannel, thermal management, thermal resistance, pumping power heat sink for thermal management of concentrated photovoltaic cells; details of the model-based parametric study that is carried NOMENCLATURE out on the heat sink is also detailed...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 27–29, 2020
Paper No: IPACK2020-2662
.... The chosen heatsink geometries were: Parallel plate, Pin fin, and Plate fin heatsinks. 1 Contact author: amirezza.nizamand@mavs.uta.edu Keywords: Open commute server, thermal conductivity, specific heat, mass concentration, immersion cooling, CPU temperature, pressure drop, pumping power NOMENCLATURE h heat...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 213-220, July 8–12, 2007
Paper No: IPACK2007-33285
... resistance and T c − T a are established. A Sequential Quadratic Programming with multi-starting-point method is successfully employed to automatically and efficiently seek a globally optimal thermal performance. An optimal design of HS/TEC assemblies under both COP ≥ 2 and pumping power limitation...